SiC Wafer Boat Carrier

In the rapidly evolving landscape of semiconductor manufacturing—specifically the production of SiC and GaN power devices for EVs, 5G infrastructure, and renewable energy—the reliability of your wafer handling hardware is non-negotiable. Semicorex SiC Wafer Boat Carrier represents the pinnacle of material engineering, designed to replace traditional quartz and graphite components in high-temperature, high-purity environments.

Why Silicon Carbide is the Industry Choice

As semiconductor nodes shrink and wafer sizes transition toward 200mm (8-inch), the thermal and chemical limitations of quartz become a bottleneck. Our SiC Wafer Boat Carrier are engineered using Sintered Silicon Carbide or CVD-coated SiC, offering a unique combination of thermal conductivity, mechanical strength, and chemical inertness.

1. Exceptional Thermal Stability

Traditional materials often suffer from "slumping" or deformation when exposed to the extreme temperatures required for diffusion and annealing. Our SiC Wafer Boat Carrier maintain structural integrity at temperatures exceeding 1,600°C. This high thermal stability ensures that wafer slots remain perfectly aligned, preventing wafer "rattle" or jamming during automated robotic transfers.

2. High Purity and Low Contamination

In a cleanroom environment, particles are the enemy of yield. Our boat carriers undergo a proprietary CVD (Chemical Vapor Deposition) coating process. This creates a dense, non-porous surface that acts as a barrier against impurity outgassing. With ultra-low metallic impurity levels, our carriers ensure that your wafers—whether Silicon or Silicon Carbide—remain free from cross-contamination during critical high-heat cycles.

3. Matched CTE (Coefficient of Thermal Expansion)

One of the primary causes of wafer stress and slip lines is a mismatch in thermal expansion between the carrier and the wafer. Our SiC boats are designed with a CTE that closely matches SiC wafers. This synchronization minimizes mechanical stress during rapid heating and cooling phases (RTP), significantly improving overall die yield.

Key Technical Specifications

Applications in Advanced Fabrication

Our SiC Wafer Boat Carrier are optimized for the most demanding "hot zone" processes in the fab:

• LPCVD & PECVD: High resistance to chemical precursors prevents the boat from degrading, ensuring a consistent process kit lifespan.
• High-Temperature Oxidation: Unlike quartz, SiC does not devitrify, maintaining its strength over thousands of cycles.
• Diffusion and Annealing: Superior thermal uniformity across the boat ensures that every wafer in the batch experiences the exact same thermal profile.
• SiC Epitaxy: Specifically designed to withstand the harsh environments required for growing epitaxial layers on SiC substrates.

Durability Meets Cost-Efficiency

While the initial investment in SiC hardware is higher than quartz, the Total Cost of Ownership (TCO) is significantly lower. Our carriers are built for longevity, often lasting 5 to 10 times longer than traditional materials. This reduces the frequency of tool downtime for parts replacement and minimizes the risk of catastrophic boat failure that could ruin an entire batch of expensive wafers.

Trust Your Process to Proven Engineering

We understand that in the semiconductor industry, "good enough" is never enough. Our manufacturing process includes 100% CMM dimensional inspection and high-purity ultrasonic cleaning before vacuum packaging.

Whether you are scaling up a 200mm SiC power device line or optimizing a legacy 150mm process, our engineering team is available to customize slot pitch, boat length, and handle configurations to fit your specific furnace requirements.