English
Home > Products > Semiconductor Etching Carrier

China Semiconductor Etching Carrier Manufacturers, Suppliers, Factory

owing to excellent support, a variety of top of the range items, aggressive rates and efficient delivery, we enjoy a very good reputation among our clients. We have been an energetic firm with wide market for Semiconductor Etching Carrier,Etch Carrier(ICP/PSS),SiC-Coated Plasma Etch Susceptor,SiC Etching Fixture,SiC Etching Solutions, We sincerely welcome domestic and foreign merchants who calls, letters asking, or to plants to negotiate, we will offer you quality products and the most enthusiastic service,We look forward to your visit and your cooperation.
Semiconductor Etching Carrier, Many products fully conform to the most rigorous of international guidelines and with our first-rate delivery service you will have them delivered at any time and in any place. And because Kayo deals in the entire spectrum of protective equipment, our customers don't have to waste time shopping around.

Related Products

Hot Products

  • Spare Parts in Epitaxial Growth

    Spare Parts in Epitaxial Growth

    Semicorex Spare Parts in Epitaxial Growth are crucial components utilized within epitaxial growth systems, particularly in processes involving quartz tube setups. These parts play a vital role in facilitating gas flow to drive tray base rotation and ensure precise temperature control throughout the epitaxial growth process. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiC Coating Ring

    SiC Coating Ring

    Semicorex SiC Coating Ring is a critical component in the demanding environment of semiconductor epitaxy processes. With our steadfast commitment to providing top-quality products at competitive prices, we are ready to become your long-term partner in China.*
  • MOCVD 3x2’’ Susceptor

    MOCVD 3x2’’ Susceptor

    Semicorex MOCVD 3x2’’ Susceptor developed by Semicorex represents a pinnacle of innovation and engineering excellence, specifically tailored to meet the intricate demands of contemporary semiconductor manufacturing processes.**
  • SiC Coated Waferholder

    SiC Coated Waferholder

    Semicorex SiC Coated Waferholder is a high-performance component designed for the precise placement and handling of SiC wafers during epitaxy processes. Choose Semicorex for its commitment to delivering advanced, reliable materials that enhance the efficiency and quality of semiconductor manufacturing.*
  • RTP SiC Coating Plates

    RTP SiC Coating Plates

    Semicorex RTP SiC Coating Plates are high-performance wafer carriers engineered for use in demanding Rapid Thermal Processing environments. Trusted by leading semiconductor manufacturers, Semicorex delivers superior thermal stability, durability, and contamination control backed by rigorous quality standards and precision manufacturing.*
  • SiC Lid

    SiC Lid

    Semicorex SiC Lid is a high-purity silicon carbide component engineered for extreme semiconductor processing environments. Choosing Semicorex means ensuring unmatched material quality, precision engineering, and custom solutions trusted by leading semiconductor manufacturers worldwide.*
  • Related Blog
  • Reviews

  • Discussing CVD furnace

  • Introducing Physical Vapor Transport (PVT) 

    SiC's own characteristics determine its single crystal growth is more difficult. Due to the absence of Si:C=1:1 liquid phase at atmospheric pressure, the more mature growth process adopted by the mainstream of the semiconductor industry can not be used to grow the more mature growth method-straight pulling method, the descending crucible method and other methods for growth. After theoretical calculations, only when the pressure is greater than 105 atm and the temperature is higher than 3200 ℃, can we get the stoichiometric ratio of Si:C = 1:1 solution. pvt method is currently one of the more mainstream methods.

  • Substrate Cutting and Grinding Process

    SiC substrate material is the core of SiC chip. The production process of the substrate is: after obtaining the SiC crystal ingot through single crystal growth; then preparing the SiC substrate requires smoothing, rounding, cutting, grinding (thinning); mechanical polishing, chemical mechanical polishing; and cleaning, testing, etc. Process

  • Main steps in SiC substrate processing

    The processing of 4H-SiC substrate mainly includes the following steps:

  • Analyzing the Applications and Development Prospects of SiC Ceramics in the Semiconductor and Photovoltaic Sectors

    Silicon carbide (SiC), as an important high-end ceramic material, has excellent properties such as high-temperature resistance, corrosion resistance, wear resistance, high-temperature mechanical strength, and oxidation resistance. These properties make it highly promising for applications in high-tech fields such as semiconductors, nuclear energy, defense, and space technology.

  • What is Low Temperature Plasma Etching?

    Plasma is the fourth state of matter, and it plays a crucial role in both industrial applications and natural phenomena.

Send Inquiry

Hit enter to search or ESC to close
X
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept