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China SiC Etching Fixture Manufacturers, Suppliers, Factory

Our mission is usually to turn into an innovative provider of high-tech digital and communication devices by providing worth added design and style, world-class producing, and repair capabilities for SiC Etching Fixture,Etch Carrier(ICP/PSS),SiC-Coated Plasma Etch Susceptor,SiC Etching Solutions,Etch Carrier, We welcome new and previous customers from all walks of lifetime to speak to us for future organization relationships and mutual achievement!
SiC Etching Fixture, All the imported machines effectively control and guarantee the machining precision for the products. Besides, we have a group of high-quality management personnels and professionals, who make the high-quality products and have the ability to develop new products to expand our market home and abroad. We sincerely expect customers come for a blooming business for both of us.

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    Wafer carriers used in epixial growth and wafer handling processing must endure high temperatures and harsh chemical cleaning. Semicorex SiC Coated PSS Etching Carrier engineered specifically for these demanding epitaxy equipment applications. Our products have a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner in China.
  • SiC Shower Head

    SiC Shower Head

    Semicorex SiC Shower Head is an essential component in the epitaxial growth process, specifically designed to enhance the uniformity and efficiency of thin film deposition on semiconductor wafers. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Fused Quartz Pedestal

    Fused Quartz Pedestal

    The Fused Quartz Pedestal, is specifically designed for use in Atomic Layer Deposition (ALD), Low-Pressure Chemical Vapor Deposition (LPCVD), and diffusion processes, ensuring uniform deposition of thin films on wafer surfaces.**
  • CVD TaC Coated Rings

    CVD TaC Coated Rings

    Semicorex CVD TaC Coated Rings are high-performance flow guide components used in crystal growth furnaces to ensure precise gas control and thermal stability. Semicorex offers unmatched quality, engineering expertise, and proven performance in the most demanding semiconductor environments.*
  • Semiconductor Quartz Crucibles

    Semiconductor Quartz Crucibles

    Semicorex Semiconductor Quartz Crucibles are high-purity fused quartz containers engineered for the demanding silicon single crystal pulling process in semiconductor manufacturing. Choosing Semicorex means benefiting from advanced multi-layer crucible technology, exceptional material purity, and stringent quality control that ensure superior crystal quality and consistent production performance.*
  • PFA Wafer Cassettes

    PFA Wafer Cassettes

    Semicorex PFA Wafer Cassettes are high-purity carriers designed to ensure safe and contamination-free handling of semiconductor wafers during wet processing, storage, and transport. Choosing Semicorex guarantees not only superior PFA material quality but also precision engineering that delivers reliability, cleanliness, and long-term performance in advanced fabrication environments.*
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  • Dislocation in SiC crystals

    SiC substrate can have microscopic defects, such as Threading Screw Dislocation (TSD), Threading Edge Dislocation (TED), Base Plane Dislocation (BPD), and others. These defects are caused by deviations in the arrangement of atoms at the atomic level.

  • Plasma Processes in CVD Operations

    Chemical Vapor Deposition (CVD) refers to a process technology where multiple gaseous reactants at varied partial pressures undergo a chemical reaction under specific temperature and pressure conditions. The resulting solid substance deposits on the surface of the substrate material, thereby obtaining the desired thin film. In traditional integrated circuit manufacturing processes, the obtained thin film materials are generally compounds such as oxides, nitrides, carbides, or materials like polycrystalline silicon, amorphous silicon, etc.

  • Monocrystalline silicon vs. polycrystalline silicon

    Single crystal silicon and polycrystalline silicon each have their own unique advantages and applicable scenarios. Single crystal silicon is suitable for high-performance electronic products and microelectronics due to its excellent electrical and mechanical properties. Polycrystalline silicon, on the other hand, dominates the field of solar cells due to its low cost and good photoelectric conversion efficiency.

  • Final polishing of the silicon wafer surface

    To achieve the high-quality requirements of IC chip circuit processes with line widths smaller than 0.13μm to 28nm for 300mm diameter silicon polishing wafers, it is essential to minimize contamination from impurities, such as metal ions, on the wafer's surface.

  • Application of GaN

    There are many types of gallium nitride (GaN), with silicon-based GaN being the most discussed. This technology involves growing GaN materials directly on a silicon substrate.

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