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China LED GaN Epitaxial Wafers on PSS Manufacturers, Suppliers, Factory

We rely upon strategic thinking, constant modernisation in all segments, technological advances and of course upon our employees that directly participate in our success for LED GaN Epitaxial Wafers on PSS,Etch Carrier(ICP/PSS),Large-Size PSS Etch Plate,Patterned Sapphire Substrates(PSS) for UV LEDs,Sapphire Wafers, Should you pursuit the Hi-quality, Hi-stable, Aggressive price tag parts, business name is your most effective choice!
LED GaN Epitaxial Wafers on PSS, Our company adheres to the spirit of "lower costs, higher quality, and making more benefits for our clients". Employing talents from the same line and adhering to the principle of "honesty, good faith, real thing and sincerity", our company hopes to gain common development with clients from both at home and abroad!

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  • Czochralski method

    Wafers are sliced from crystal rods, which are produced from polycrystalline and pure undoped intrinsic materials. The process of transforming polycrystalline material into single crystals through melting and recrystallization is known as crystal growth. Currently, two main methods are employed for this process: the Czochralski method and the zone melting method. Among these, the Czochralski method (often referred to as the CZ method) is the most significant for growing single crystals from melts. In fact, over 85% of single crystal silicon is produced using the Czochralski method.

  • Major ceramic components in semiconductor manufacturing

    Semiconductor equipment consists of chambers and chambers, and most ceramics are used in chambers closer to the wafers. Ceramic parts, important components widely used in the cavities of core equipment, are semiconductor equipment components manufactured through precision processing using advanced ceramic materials such as alumina ceramics, aluminum nitride ceramics, and silicon carbide ceramics.

  • Silicon Carbide(SiC) Crystal Growth Furnace

    Crystal growth is the core link in the production of Silicon Carbide substrates, and the core equipment is the crystal growth furnace. Similar to traditional crystalline silicon-grade crystal growth furnaces, the furnace structure is not very complex and mainly consists of a furnace body, a heating system, a coil transmission mechanism, a vacuum acquisition and measurement system, a gas path system, a cooling system, a control system, etc., among which Thermal field and process conditions determine the quality, size, conductive properties and other key indicators of Silicon Carbide crystals.

  • Homoepitaxy and Heteroepitaxy Explained Simply

    Homoepitaxy and heteroepitaxy play pivotal roles in material science. Homoepitaxy involves the growth of a crystalline layer on a substrate of the same material, ensuring minimal defects due to perfect lattice matching. In contrast, heteroepitaxy grows a crystalline layer on a different material substrate, which can lead to challenges like lattice mismatch. These processes are crucial in advancing semiconductor devices and thin films. For instance, heteroepitaxy significantly impacts microelectronics and quantum optics, contributing to innovations like Light Emitting Diodes.

  • How Advanced Materials Solve 3 Critical Challenges in Semiconductor Furnace Design

    The race to shrink transistor sizes and scale solar cell efficiency is pushing thermal processing equipment to its limits.

  • Oxidation Process

    The most basic stage of all processes is the oxidation process. The oxidation process is to place the silicon wafer in an atmosphere of oxidants such as oxygen or water vapor for high-temperature heat treatment (800~1200℃), and a chemical reaction occurs on the surface of the silicon wafer to form an oxide film (SiO2 film).

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