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"Based on domestic market and expand abroad business" is our progress strategy for carbon carbon composite,cfc fixture,cfc composite,cfc carbon fiber,carbon fiber reinforcement, We're going to provide high-quality merchandise and excellent products and services at competitive costs. Start benefiting from our comprehensive products and services by contacting us today.
carbon carbon composite, Our merchandise are mainly exported to Southeast Asia, the Middle East, North America and Europe. Our quality is surely guaranteed. If you are interested in any of our items or would like to discuss a custom order, make sure you feel free to contact us. We've been looking forward to forming successful business relationships with new clients around the world in the near future.

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    Aluminum Nitride Ceramic Chuck

    Semicorex Aluminum Nitride Ceramic Chuck represents a cutting-edge solution for semiconductor wafer processing, specifically designed to securely hold wafers in place during various stages of manufacturing. Functioning as an electrostatic chuck (ESC), this innovative device leverages the exceptional properties of aluminum nitride ceramic to ensure precise and reliable wafer retention. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Silicon Annealing Boat

    Silicon Annealing Boat

    Semicorex Silicon Annealing Boat, meticulously designed for handling and processing silicon wafers, play a crucial role in achieving high-performance semiconductor devices. Its unique design features and material properties make it essential for critical fabrication steps like diffusion and oxidation, ensuring uniform processing, maximizing yield, and contributing to the overall quality and reliability of semiconductor devices.**
  • RTP RTA SiC Coated Carrier

    RTP RTA SiC Coated Carrier

    Semicorex is a large-scale manufacturer and supplier of Silicon Carbide Coated Graphite Susceptor in China. Semicorex graphite susceptor engineered specifically for epitaxy equipment with high heat and corrosion resistance in China. Our RTP RTA SiC Coated Carrier has a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner.
  • AlN Ceramic Disc

    AlN Ceramic Disc

    Semicorex AlN Ceramic Disc stands out as a material of exceptional capability, prized for its unique combination of thermal, mechanical, and electrical properties. At Semicorex, we are at the forefront of manufacturing AlN Ceramic Discs, ensuring that these components meet the stringent demands of modern technology and industrial applications.**
  • End Effector for Wafer Handling

    End Effector for Wafer Handling

    Semicorex End Effector for Wafer Handling are dimensionally precise and thermally stable for wafer processing. We have been manufacturer and supplier of silicon carbide coating elements for many years. Our products have a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
  • Tantalum Carbide Coated Graphite Susceptor

    Tantalum Carbide Coated Graphite Susceptor

    Semicorex provides Tantalum Carbide Coated Graphite Susceptor with customized service. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
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  • How Are Ceramic Electrostatic Chucks Actually Produced?

    In semiconductor manufacturing, the precision and stability of the etching process are paramount. One critical factor in achieving high-quality etching is ensuring that wafers are perfectly flat on the tray during the process. Any deviation can lead to uneven ion bombardment, causing undesirable angles and variations in etching rates. To address these challenges, engineers have developed Electrostatic Chucks (ESCs), which have significantly improved etching quality and stability. This article delves into the design and functionality of ESCs, focusing on one key aspect: the electrostatic principles behind wafer adhesion.

  • GaN vs SiC

    There are several materials currently under investigation, among which silicon carbide stands out as one of the most promising. Similar to GaN, it boasts higher operating voltages, higher breakdown voltages, and superior conductivity compared to silicon. Moreover, thanks to its high thermal conductivity, silicon carbide can be utilized in environments with extreme temperatures. Lastly, it is significantly smaller in size yet capable of handling greater power.

  • 3 methods of graphite molding

    The four main molding methods for graphite molding are: extrusion molding, molding, vibratory molding and isostatic molding. Most of the common carbon/graphite materials on the market are molded by hot extrusion and molding (cold or hot), and isostatic molding is a method with leading molding performance. Vibration molding is generally used to manufacture medium and coarse structural graphite, particle size between 0.5-2mm particle size, generally dominated by di-roasted graphitized products, density between 1.55-1.75kg/m³, coarser particles, rougher surface, can not be used for precision machining. It is mainly used in chemical industry and metal smelting.

  • High-Purity CVD Thick SiC: Process Insights for Material Growth

    Thick, high-purity silicon carbide (SiC) layers, typically exceeding 1mm, are critical components in various high-value applications, including semiconductor fabrication and aerospace technologies. This article delves into the Chemical Vapor Deposition (CVD) process for producing such layers, highlighting key process parameters, material characteristics, and emerging applications.

  • Method of GaN Crystal Growth

    When producing large-sized GaN single crystal substrates, HVPE is currently the best choice for commercialization. However, the back carrier concentration of the grown GaN cannot be precisely controlled.

  • How Advanced Materials Solve 3 Critical Challenges in Semiconductor Furnace Design

    The race to shrink transistor sizes and scale solar cell efficiency is pushing thermal processing equipment to its limits.

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