Semicorex 4-Inch SiC Boats are high-performance wafer carriers designed for superior thermal and chemical stability in semiconductor manufacturing. Trusted by industry leaders, Semicorex combines advanced materials expertise with precision engineering to deliver products that enhance yield, reliability, and operational efficiency.*
Semicorex 4-inch SiC Boats are engineered to meet the demanding requirements of modern semiconductor manufacturing processes, particularly in high-temperature and corrosive environments. Built with precision from high-purity SiC material, these boats offer exceptional thermal stability, mechanical strength, and chemical resistance—making them ideal for the safe handling and processing of 4-inch wafers during diffusion, oxidation, LPCVD, and other high-temperature treatments.
The manufacturing process of semiconductor wafer chips mainly covers three stages: (front stage) chip manufacturing, (middle stage) chip manufacturing, (back stage) packaging and testing. (front stage) The chip manufacturing process mainly includes: pulling single crystals, grinding outer circles, slicing, chamfering, grinding and polishing, cleaning, and testing; (middle stage) wafer chip manufacturing mainly includes: oxidation, diffusion and other heat treatments, thin film deposition (CVD, PVD), lithography, etching, ion implantation, metallization, grinding and polishing, and testing; (back stage) packaging and testing mainly involves wafer chip cutting, wire bonding, plastic sealing, testing, etc. The entire semiconductor industry chain includes IC design, IC manufacturing, and IC packaging and testing. The key process processes and equipment involved include: lithography, etching, ion implantation, thin film deposition, chemical mechanical polishing, high temperature heat treatment, packaging, testing, etc.
In the process of semiconductor chip manufacturing, the six important processes of high-temperature heat treatment, deposition (CVD, PVD), lithography, etching, ion implantation, and chemical mechanical polishing (CMP) require not only cutting-edge equipment, but also a large number of high-performance precision ceramic components in these equipment, including electrostatic chucks, vacuum suction cups, heaters, transfer arms, focusing rings, nozzles, workbenches, cavity liners, deposition rings, pedestals, wafer boats, furnace tubes, cantilever paddles, ceramic domes and cavities, etc.
Each 4-inch SiC boat undergoes strict quality control, including dimensional inspection, flatness measurement, and thermal stability testing. Surface finish and slot geometry can be tailored to customer specifications. Optional coatings and polishing can further enhance chemical resistance or minimize micro-particle retention for ultra-cleanroom applications.
When precision, purity, and durability are critical, our 4-inch SiC Boats provide a superior solution for advanced semiconductor processing. Trust our expertise and material excellence to enhance your process performance and yield.