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China SiC Coated Etching Components Manufacturers, Suppliers, Factory

Always customer-oriented, and it's our ultimate target to be not only the most reliable, trustable and honest supplier, but also the partner for our customers for SiC Coated Etching Components,Etch Carrier(ICP/PSS),ICP Etch Carrier,Etching Carrier,Etch Plate, We welcome all with the consumers and pals to call us for mutual positive aspects. Hope to do additional company along with you.
SiC Coated Etching Components, We always stick to the tenet of "sincerity, high quality, high efficiency, innovation". With years of efforts, we have established friendly and stable business relationships with worldwide customers. We welcome any of your inquiries and concerns for our merchandise, and we have been sure that we'll supply just what you want, as we always believe that your satisfaction is our success.

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  • SiC Epi-Wafer Susceptor

    SiC Epi-Wafer Susceptor

    Semicorex is a large-scale manufacturer and supplier of Silicon Carbide Coated Graphite Susceptor in China. We focus on semiconductor industries such as silicon carbide layers and epitaxy semiconductor. Our SiC Epi-Wafer Susceptor has a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner.
  • TaC Coated Graphite Part

    TaC Coated Graphite Part

    Semicorex TaC Coated Graphite Part is a high-performance component designed for use in SiC crystal growth and epitaxy processes, featuring a durable Tantalum Carbide coating that enhances thermal stability and chemical resistance. Choose Semicorex for our innovative solutions, superior product quality, and expertise in providing reliable, long-lasting components tailored to meet the demanding needs of the semiconductor industry.*
  • Quartz Ring

    Quartz Ring

    Semicorex Quartz Ring stands as an indispensable component within the intricate realm of semiconductor manufacturing. Crafted with precision and engineered to exacting standards, this ring embodies durability, purity, and functionality, pivotal for the success of semiconductor fabrication processes. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiC Boat for Solar Cell Diffusion

    SiC Boat for Solar Cell Diffusion

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  • Graphite Waferholder

    Graphite Waferholder

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  • Related Blog
  • Reviews

  • What is isostatic graphite?

    Isostatic graphite is a type of graphite with an ultra-fine grain. It is used for applications where the mechanical properties of other fine-grained graphites are inadequate.

  • What is quartz?

    Quartz (SiO₂) material is very similar to glass at first glance, but the special thing is that the general glass is made up of many components (such as quartz sand, borax, boric acid, barite, barium carbonate, limestone, feldspar, soda ash, etc.), while the quartz contains only SiO₂ components, and the microstructure of its silicon dioxide tetrahedral structural units composed of a simple network.

  • Applications of TaC Coated Graphite Components

    In the process of growing SiC and AlN single crystals by the physical vapor transport method (PVT), components such as the crucible, seed crystal holder and guide ring play a vital role. During the preparation process of SiC, the seed crystal is located in a relatively low temperature region, while the raw material is in a high temperature region exceeding 2400°C. The raw materials decompose at high temperatures to form SiXCy (including Si, SiC₂, Si₂C and other components).

  • About defects in SiC crystals - Micropipe

    SiC substrate can have microscopic defects, such as Threading Screw Dislocation (TSD), Threading Edge Dislocation (TED), Base Plane Dislocation (BPD), and others. These defects are caused by deviations in the arrangement of atoms at the atomic level. SiC crystals may also have macroscopic dislocations, like Si or C inclusions, micropipe, hexagonal voids, polymorphs, etc. These dislocations are typically large in size.

  • Oxidation Process

    The most basic stage of all processes is the oxidation process. The oxidation process is to place the silicon wafer in an atmosphere of oxidants such as oxygen or water vapor for high-temperature heat treatment (800~1200℃), and a chemical reaction occurs on the surface of the silicon wafer to form an oxide film (SiO2 film).

  • TSMC: 2nm process risk trial production next year

    In their newly released annual report, TSMC Chairman Deyin Liu and CEO Chieh-Jia Wei revealed the progress related to the 2nm process.

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