English
Home > Products > Etch Plate

China Etch Plate Manufacturers, Suppliers, Factory

Gaining purchaser gratification is our firm's intention eternally. We will make wonderful endeavours to build new and top-quality merchandise, satisfy your exclusive needs and provide you with pre-sale, on-sale and after-sale products and services for Etch Plate,Etch Carrier(ICP/PSS),ICP Etch Carrier,SiC Coated Etching Components,Etching Carrier, Our final goal is "To try the best, To be the Best". Please feel free to contact with us if you have any requirements.
Etch Plate, Wide selection and fast delivery to suit your needs! Our philosophy: Good quality, great service, keep improving. We are looking forward that more and more oversea friends join in our family for further development near the future!

Related Products

Hot Products

  • MOCVD Wafer Carriers for Semiconductor Industry

    MOCVD Wafer Carriers for Semiconductor Industry

    Semicorex MOCVD Wafer Carriers for Semiconductor Industry is a top-of-the-line carrier designed for use in the semiconductor industry. Its high-purity material ensures even thermal profile and laminar gas flow pattern, delivering high-quality wafers.
  • Flexible Graphite Foil

    Flexible Graphite Foil

    Semicorex Flexible Graphite Foil is a high performance, flexible material designed for sealing and gasketing applications. When you choose a Semicorex product, you get superior quality and reliability, ensuring your most stringent industry standards are met.*
  • CVD SiC Focus Ring

    CVD SiC Focus Ring

    Through a process of chemical vapor deposition (CVD), Semicorex CVD SiC Focus Ring is meticulously deposited and mechanically processed to achieve the final product. With its superior material properties, it's indispensable in the demanding environments of modern semiconductor fabrication.**
  • SiC Ceramic Plate

    SiC Ceramic Plate

    Semicorex SiC Ceramic Plate offers unmatched performance in environments requiring wear resistance, corrosion resistance, and high-temperature stability. This product is designed for use as lining plates and support parts across a variety of demanding applications.
  • SiC Gasket

    SiC Gasket

    Semicorex prioritizes quality and performance, ensuring that each SiC Gasket meets stringent industry standards. Our cutting-edge manufacturing processes guarantee that our products deliver consistent and reliable results, positioning Semicorex as a leader in the field of advanced ceramics.
  • Rigid Insulation

    Rigid Insulation

    Semicorex Rigid Insulation is a high-performance short fiber hard felt, specially developed for thermal management in epitaxy equipment. Choosing Semicorex means choosing proven expertise, premium materials, and customized solutions that ensure the highest purity, reliability, and efficiency for your semiconductor manufacturing processes.*
  • Related Blog
  • Reviews

  • Difficulty in preparing SiC substrates

    At present, the most important direction trend of substrate development is to expand the diameter. The 6-inch mass production line in the global SiC market is maturing, and leading companies have entered the 8-inch market.

  • Why Doesn’t Gllium Nitride (GaN) Epitaxy Grow on a GaN substrate?

    The growth of GaN epitaxy on GaN substrate presents a unique challenge, despite the material’s superior properties when compared to silicon. GaN epitaxy offers significant advantages in terms of band gap width, thermal conductivity, and breakdown electric field over silicon-based materials. This makes the adoption of GaN as the backbone for the third generation of semiconductors, which provide enhanced cooling, lower conduction loss, and improved performance under high temperatures and frequencies, a promising and crucial advancement for the photonic and micro-electronic industries.

  • Why Use Ultrasonic Cleaning in Semiconductor Manufacturing

    When cleaning wafers, ultrasonic cleaning and megasonic cleaning are commonly used to remove particles from the wafer surface.

  • How Are Ceramic Electrostatic Chucks Actually Produced?

    In semiconductor manufacturing, the precision and stability of the etching process are paramount. One critical factor in achieving high-quality etching is ensuring that wafers are perfectly flat on the tray during the process. Any deviation can lead to uneven ion bombardment, causing undesirable angles and variations in etching rates. To address these challenges, engineers have developed Electrostatic Chucks (ESCs), which have significantly improved etching quality and stability. This article delves into the design and functionality of ESCs, focusing on one key aspect: the electrostatic principles behind wafer adhesion.

  • Final polishing of the silicon wafer surface

    To achieve the high-quality requirements of IC chip circuit processes with line widths smaller than 0.13μm to 28nm for 300mm diameter silicon polishing wafers, it is essential to minimize contamination from impurities, such as metal ions, on the wafer's surface.

  • The unit in semiconductor: Angstrom

    As a unit of length, Angstrom (Å) is ubiquitous in integrated circuit manufacturing. From precise control of material thickness to miniaturization and optimization of device size, the understanding and application of Angstrom scale is the core to ensure the continuous development of semiconductor technology.

Related Search

ICP Etch plateLarge-Size PSS Etch PlatePSS Etch PlateSilicon Etch Plate

Send Inquiry

Hit enter to search or ESC to close
X
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept