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ring assembly, Our mission is to deliver consistently superior value to our customers and their clients. This commitment permeates everything we do, driving us to continuously develop and improve our solutions and the processes to fulfill your needs.

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  • SiC Coated Graphite Base Susceptors for MOCVD

    SiC Coated Graphite Base Susceptors for MOCVD

    Semicorex SiC Coated Graphite Base Susceptors for MOCVD are superior quality carriers used in the semiconductor industry. Our product is designed with high-quality silicon carbide that provide excellent performance and long-lasting durability. This carrier is ideal for use in the process of growing an epitaxial layer on the wafer chip.
  • SiC Susceptor for MOCVD

    SiC Susceptor for MOCVD

    Semicorex is a leading manufacturer and supplier of SiC Susceptor for MOCVD. Our product is specially designed to cater to the needs of the semiconductor industry in growing the epitaxial layer on the wafer chip. The product is used as the center plate in MOCVD, with a gear or ring-shaped design. It has high heat and corrosion resistance, making it ideal for use in extreme environments.
  • CFC Nut and Bolt

    CFC Nut and Bolt

    Semicorex is proud to present the CFC Nut and Bolt, a groundbreaking innovation in the realm of high-performance fasteners. Developed from a sophisticated carbon fiber matrix, this product embodies the pinnacle of composite material engineering, designed specifically to meet the demands of high-temperature environments where traditional materials fall short.
  • Tantalum Carbide Crucible

    Tantalum Carbide Crucible

    Semicorex Tantalum Carbide Crucible is a crucial component in the semiconductor industry, specifically designed for the growth of Silicon Carbide (SiC) crystals. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China*.
  • Graphite Single Silicon Pulling Tools

    Graphite Single Silicon Pulling Tools

    Semicorex Graphite Single Silicon Pulling Tools emerge as unsung heroes in the fiery crucible of crystal growth furnaces, where temperatures soar and precision reigns supreme. Their remarkable properties, honed through innovative manufacturing, make them essential for coaxing flawless single crystal silicon into existence.**
  • Semiconductor Quartz Crucibles

    Semiconductor Quartz Crucibles

    Semicorex Semiconductor Quartz Crucibles are high-purity fused quartz containers engineered for the demanding silicon single crystal pulling process in semiconductor manufacturing. Choosing Semicorex means benefiting from advanced multi-layer crucible technology, exceptional material purity, and stringent quality control that ensure superior crystal quality and consistent production performance.*
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  • What is P-type SiC wafer?

    A P-type silicon carbide (SiC) wafer is a semiconductor substrate that is doped with impurities to create a P-type (positive) conductivity. Silicon carbide is a wide-bandgap semiconductor material that offers exceptional electrical and thermal properties, making it suitable for high-power and high-temperature electronic devices.

  • What are epitaxial wafers used for?

    Epitaxial wafers have been used in the electronics industry for decades, but their importance has only increased as technology has advanced. In this article, we will explore what epitaxial wafers are and why they are such an essential component of modern electronics.

  • Exploring the Future Prospects of Silicon Semiconductor Chips

  • Why Doesn’t Gllium Nitride (GaN) Epitaxy Grow on a GaN substrate?

    The growth of GaN epitaxy on GaN substrate presents a unique challenge, despite the material’s superior properties when compared to silicon. GaN epitaxy offers significant advantages in terms of band gap width, thermal conductivity, and breakdown electric field over silicon-based materials. This makes the adoption of GaN as the backbone for the third generation of semiconductors, which provide enhanced cooling, lower conduction loss, and improved performance under high temperatures and frequencies, a promising and crucial advancement for the photonic and micro-electronic industries.

  • Final polishing of the silicon wafer surface

    To achieve the high-quality requirements of IC chip circuit processes with line widths smaller than 0.13μm to 28nm for 300mm diameter silicon polishing wafers, it is essential to minimize contamination from impurities, such as metal ions, on the wafer's surface.

  • TaC Coating

    According to the research results, TaC coating can act as a protection and isolation layer to extend graphite component life, improve radial temperature uniformity, maintain SiC sublimation stoichiometry, suppress impurity migration, and reduce energy consumption. Ultimately a TaC-coated graphite crucible set is expected to improve SiC PVT process control and product quality.

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