Semicorex SiC Arm is a high-purity silicon carbide component designed for precise wafer handling and positioning in semiconductor manufacturing. Choosing Semicorex ensures unmatched material reliability, chemical resistance, and precision engineering that support the most demanding semiconductor processes.*
Semicorex SiC Arm is a specialized device that was developed to handle wafers with maximum reliability and precision. Wafer transfer arms, like the SiC Arm appear in advanced semiconductor-manufacturing equipment like epitaxial reactors, ion implantation systems, thermal processing, etc. Wafer transfer arms are integral to the accurate movement of wafers within complex wafer handling environments to assure safe and accurate transfer of wafers being processed. Constructed using high-purity silicon carbide combined with the raw material properties of
exceptional thermal and chemical stability, and excellent machining control, make the SiC Arm a trusted solution for future semiconductor manufacturing.
SiC Arm has its exceptional performance in extreme thermal environments. In epitaxial growth as well as other high-temperature processes, wafer handling components can be subjected to sustained heat that easily deteriorates a conventional material’s characteristics. Silicon carbide retains both strength and dimensional accuracy (finite dimensional tolerances) at high temperatures, which ensures wafers can remain precisely seated during transfer or processing, and virtually eliminate wafer misalignment, warpage, or contamination. The ceramic with the exceptional performance of a SiC product; like the SiC Arm does not oxidize, distort like a metal, nor have failure performance characteristics like a ceramic, which are stress cracks.
Chemical resistance is another defining property of the SiC Arm. In semiconductor environments, corrosive gases, reactive chemicals, and plasma exposure are common. A handling arm that deteriorates under such conditions not only risks mechanical failure but also contamination of wafers. Silicon carbide provides a chemically inert surface that withstands these aggressive conditions. The result is a highly reliable component that maintains surface integrity and cleanliness, safeguarding wafers from impurities that could compromise device performance. This durability significantly reduces equipment downtime, lowers replacement frequency, and enhances process consistency.
Beyond its material resilience, SiC Arm also meets a high degree of machining accuracy. Wafer handling requires accuracy to the micrometer; tolerances that are even slightly out of specification can cause changes in geometry or surface finish that can cause higher risks in wafer breakage or wafer misalignment. By using modern manufacturing technologies, SiC Arms are produced with proper tolerances, flatness, and smooth surfaces. Being high-precision applications is ideal for assuring consistent positioning of wafers and repeatable performance during thousands of handling cycles, which is ideal for high volume semiconductor production that has demanding specifications.
Versatility is another advantage of SiC arms. Different semiconductor tools and processes require arms of different geometries, sizes and designs. Since SiC Arms can be modified to incorporate these specific design characteristics they can easily fit into a wide range of systems, whether it be an epitaxy tool, a piece of ion implantation equipment or a thermal processing reactor. Surface finishes, structural designs and finishes can also be modified and engineered to provide the best performance with respect to the particular application.
SiC Arms also has operational efficiency. SiC's high durability and reliability mean replacements are infrequent and downtime is minimized; both meaning lower long-term maintenance costs. For production semiconductor fabs this means realizing better throughput, the potential for greater stability in production, and higher device yields.
SiC Arms have seen widespread use since their introduction in the semiconductor community specifically in wafer transfer systems where they have to withstand both mechanical stresses and very rigorous processing conditions. Be it moving wafers to epitaxy reactors, holding them in place during ion implantation, or transferring them through gas or thermal processing environments, the SiC Arm provides secure, precise and contamination-free wafer handling. Reliability is apparent through the introduction of SiC Arms into the modern semiconductor equipment portfolio.
Semicorex SiC Arm is a successful combination of the desirable properties of advanced silicon carbide material, precision engineering and high-temperature stability. The combination of chemical stability, the ability to be machined and precision fabrication makes the SiC Arm suitable for providing reliable wafer handling in the toughest semi-conductor processes. The SiC Arm is customizable and durable for end-user consumable benefits for wafer handling assisting with and offer benefits in long term operating performance with respect to efficiency, yield and process stability. Manufacturers looking for modern and cutting-edge wafer handling systems or even out of box wafer handling solutions look to and rely on the SiC Arm as a proven, high performing, and capable wafer transfer and handling system for the advanced demands of the semiconductor industry.