SiSiC Wafer Boat

In the competitive landscape of semiconductor and solar cell manufacturing, balancing throughput with component longevity is essential. Our SiSiC Wafer Boat are engineered to be the "industrial workhorse" for high-temperature furnace operations. By utilizing the reaction-bonding process, we deliver a carrier that offers superior mechanical strength and thermal shock resistance compared to traditional quartz and standard ceramics.

The Science of SiSiC: Why Reaction Bonding Matters

Unlike sintered SiC, which is formed through high-pressure powder consolidation, SiSiC Wafer Boat is produced by infiltrating a porous carbon preform with molten silicon. This "Reaction Bonding" process results in a material with nearly zero shrinkage during manufacturing, allowing for the production of complex, large-scale boat architectures with incredible dimensional precision.

1. Superior Thermal Shock Resistance

One of the most critical challenges in batch processing is the rapid "push-pull" cycle of the furnace. Quartz carriers often crack under thermal stress. SiSiC possesses a significantly higher modulus of rupture (MOR) and excellent thermal conductivity. This allows our boats to withstand rapid temperature ramping without the risk of structural failure, directly translating to less equipment downtime.

2. High Load-Bearing Capacity at Temperature

As wafer sizes increase and batches become larger to maximize throughput, the weight on the carrier increases. Our SiSiC boats exhibit exceptional creep resistance. While other materials might sag or warp under heavy loads at 1,250°C, SiSiC maintains its geometry, ensuring that the wafer slot parallelism remains perfect over thousands of cycles.

3. Chemical Inertness and Surface Integrity

Our SiSiC boats are designed for harsh chemical environments. The material is inherently resistant to the corrosive gases used in LPCVD and Diffusion processes. Furthermore, the surface is treated to ensure there is no "free silicon" migration, providing a stable, clean environment that protects the electrical integrity of your wafers.

Technical Specifications: SiSiC Performance Matrix

Optimized for Global Manufacturing Standards

Our SiSiC Wafer Boat are compatible with the world’s leading furnace OEMs, including TEL (Tokyo Electron), ASM, and Kokusai Electric. We provide customized solutions for:

Horizontal Diffusion Furnaces: Long-length boats with high-precision slotting for 150mm and 200mm wafers.

Vertical Furnace Systems: Low-mass designs that optimize gas flow and thermal uniformity.

Solar PV Cell Production: Specialized SiSiC carriers designed for high-volume POCl3 diffusion, offering a service life 5-10x longer than quartz.

Expert Insight: For processes exceeding 1,380°C, we recommend our Sintered SiC line. However, for the vast majority of Diffusion, Oxidation, and LPCVD steps, SiSiC provides the most cost-effective performance-to-lifespan ratio in the industry.

Why Partner With Us?

Material Expertise: We source only high-purity alpha-SiC powder and electronic-grade silicon for our reaction bonding process.

Precision Engineering: Our CNC grinding capabilities allow for slot tolerances within ±0.02mm, reducing wafer vibration and breakage.

Sustainability & ROI: By switching from quartz to SiSiC, fabs typically see a 40% reduction in annual consumable spend due to the significantly decreased replacement frequency.

Every boat we ship is accompanied by a Certificate of Conformance (CoC) and a full dimensional inspection report, ensuring that your process kit is ready for immediate installation into the cleanroom.