SiC Ceramic Robotic Arm

SiC ceramic robotic arm is used across multiple semiconductor wafer manufacturing processes, playing a important role in ensuring the quality and efficiency of wafer fabrication. It is commonly installed inside and outside the chambers of various semiconductor front-end equipment, such as etching machines, deposition equipment, lithography machines, cleaning equipment, directly participating in the handling and positioning of semiconductor wafers. 

Semiconductor wafers are easily contaminated by particles, so their related manufacturing processes are mainly carried out in clean and vacuum semiconductor equipment. In actual operation, as the essential component of such equipment, SiC ceramic robotic arm comes into direct contact with the semiconductor wafers and must also meet ultra-high cleanliness requirements. Semicorex’s SiC ceramic robotic arm is made of high-performance silicon carbide ceramic followed by precision surface finishing and cleaning treatment, which can precisely meet the stringent requirements of semiconductor manufacturing for cleanliness and surface flatness. This contributes significantly to reduce wafer defects and improve wafer production yield.

SiC ceramic robotic arm is the optimal option for heat treatment procedures like annealing, oxidation, and diffusion. Because of the exceptional thermal stability and superior thermal shock resistance of silicon carbide materials, SiC ceramic robotic arm are able to operate dependably for prolonged periods of time under high-temperature conditions. It can resist the influence of thermal expansion and preserving its structural integrity under thermal stress, thereby ensuring the consistent accuracy of wafer positioning.

Thanks to its robust resistance to corrosive gases and liquids, SiC ceramic robotic arm can stably maintain its performance even when exposed to aggressive corrosive process atmospheres such as etching, thin film deposition, and ion implantation. This corrosion resistance performance improves the efficiency of semiconductor wafer manufacturing by effectively lowering the risk of corrosion-related component damage and reducing the need for frequent replacements and maintenance.