English
Home > Products > Hard felt

China Hard felt Manufacturers, Suppliers, Factory

We thinks what clients think, the urgency of urgency to act from the interests of a purchaser position of principle, allowing for greater top quality, decrease processing costs, price ranges are much more reasonable, won the new and aged prospects the support and affirmation for Hard felt,Rigid Felt,Composite materials,graphite felt,fiber carbon, We goal at Ongoing system innovation, management innovation, elite innovation and sector innovation, give full play for the overall advantages, and constantly make improvements to support excellent.
Hard felt, Ought to any of these products be of curiosity to you, make sure you let us know. We will be satisfied to provide you a quotation on receipt of one's in depth specifications. We have now our personalized experienced R&D enginners to meet any of one's requriements, We appear forward to receiving your enquires soon'and hope to have the opportunity to work together with you in the future. Welcome to check out our company.

Related Products

Hot Products

  • SiC Heating Filament

    SiC Heating Filament

    Semicorex SiC Heating Filament is a silicon carbide coated graphite heater designed for wafer heating in advanced semiconductor manufacturing. Choosing Semicorex means selecting a trusted partner that delivers high-purity materials, precision customization, and long-lasting performance for the most demanding thermal processes.*
  • SiC Coating Component

    SiC Coating Component

    Semicorex SiC Coating Component is an essential material designed to meet the demanding requirements of the SiC epitaxy process, a pivotal stage in semiconductor manufacturing. It plays a critical role in optimizing the growth environment for silicon carbide (SiC) crystals, contributing significantly to the quality and performance of the final product.*
  • Al2O3 Vacuum Chuck

    Al2O3 Vacuum Chuck

    Semicorex Al2O3 Vacuum Chuck is designed to meet the rigorous demands of various semiconductor production processes, including thinning, dicing, cleaning, and transporting wafers. **
  • SiC MOCVD Cover Segment

    SiC MOCVD Cover Segment

    Semicorex' s commitment to quality and innovation is evident in the SiC MOCVD Cover Segment. By enabling reliable, efficient, and high-quality SiC epitaxy, it plays a vital role in advancing the capabilities of next-generation semiconductor devices.**
  • SiC Vacuum Chuck

    SiC Vacuum Chuck

    Semicorex SiC Vacuum Chuck represents a pinnacle of precision engineering tailored for the demanding semiconductor industry. Crafted from graphite substrates and enhanced through state-of-the-art Chemical Vapor Deposition (CVD) techniques, this innovative device seamlessly integrates the unparalleled properties of Silicon Carbide (SiC) coating. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Fused Quartz Crucibles

    Fused Quartz Crucibles

    Semicorex Fused Quartz Crucibles are high-purity containers designed for semiconductor crystal growth, offering exceptional thermal stability and contamination resistance for defect-free wafer production. Choose Semicorex for strict material purity control, precision manufacturing, and proven reliability in the world’s most demanding semiconductor processes.*
  • Related Blog
  • Reviews

  • What is plasma dicing？

    Wafer dicing is the final step in the semiconductor manufacturing process, separating silicon wafers into individual chips (also called dies). Plasma dicing uses a dry etching process to etch away the material in the dicing streets through fluorine plasma to achieve the separation effect. With the advancement of semiconductor technology, the market is increasingly demanding smaller, thinner, and more complex chips. Plasma dicing is gradually replacing traditional diamond blades and laser solutions because it can improve yield, production capacity, and design flexibility, becoming the first choice of the semiconductor industry.

  • The Crucial Role of Epitaxial Layers in Semiconductor Devices

    Epitaxial growth refers to the process of growing a crystallographically well-ordered monocrystalline layer on a substrate. Generally speaking, epitaxial growth involves the cultivation of a crystal layer on a single-crystal substrate, with the grown layer sharing the same crystallographic orientation as the original substrate. Epitaxy is extensively utilized in semiconductor manufacturing, such as the production of epitaxial silicon wafers in the integrated circuit industry.

  • What is the Difference Between Graphitization and Carbonization

    In conclusion, both graphitization and carbonization are industrial processes that involve carbon either as a reactant or a product. Carbonization refers to the process of converting organic matter into carbon, while graphitization involves transforming carbon into graphite. Therefore, carbonization is classified as a chemical change, whereas graphitization is recognized as a microstructural change.

  • TaC Coating Crucible for AlN Crystal Growth

    The third generation of semiconductor materials AlN belongs to the direct bandgap semiconductor, its bandwidth of 6.2 eV, with high thermal conductivity, resistivity, breakdown field strength, as well as excellent chemical and thermal stability, is not only an important blue light, ultraviolet materials, or electronic devices and integrated circuits, important packaging, dielectric isolation and insulation materials, especially for high-temperature high-power devices. In addition, AlN and GaN have a good thermal match and chemical compatibility, AlN used as GaN epitaxial substrate, can significantly reduce the defect density in GaN devices, improve device performance.

  • Gallium Nitride Epitaxial Wafers: An Introduction to the Fabrication Process

    Gallium Nitride (GaN) epitaxial wafer growth is a complex process, often utilizing a two-step method. This method involves several critical stages, including high-temperature baking, buffer layer growth, recrystallization, and annealing. By meticulously controlling the temperature throughout these stages, the two-step growth method effectively prevents wafer warping caused by lattice mismatch or stress, making it the predominant fabrication method for GaN epitaxial wafers globally.

  • Carbon/carbon composite molding process

    Carbon/carbon composite materials refer to composite materials composed of carbon fiber reinforcement and carbon-based matrix. They have the characteristics of low density, high strength, high specific modulus, low thermal expansion coefficient, etc. Their super high temperature resistance makes them the most promising high-temperature material.

Send Inquiry

Hit enter to search or ESC to close
X
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept