SIC Porous Ceramic Debonding Chucks

With the advancement of semiconductor processing and rising demand for electronic components, the application of ultra-thin wafers have become increasingly critical. Generally, wafers with a thickness of less than 100 μm are referred to as ultra-thin wafers. However, when wafers are thinned to below 100 μm, they exhibit significant brittleness and their mechanical strength subsequently decreases, which results in high risks of wafer warping, bending, or even breakage. For this reason, choosing to use Semicorex SiC porous ceramic debonding chucks is the wise decision, which can provide reliable support and protection of ultra-thin wafers to achieve safe separation in the debonding process.

The advantages of Semicorex SiC porous ceramic debonding chucks

1.Exceptional material properties

Featuring a Mohs hardness of approximately 9.5, Semicorex SiC porous ceramic debonding chucks boast exceptional wear resistance and can long-term withstand repeated vacuum adsorption and release operations with reliable durability during debonding process.

In addition, with the superior thermal conductivity, Semicorex SiC porous ceramic debonding chucks are balely for rapidly conducting heat, which can effectively prevent local overheating that may degrade or damage wafers, especially suitable for high-temperature debonding process.

2.High-performing porous ceramic structure

Fabricated from high-quality silicon carbide powder through high-temperature sintering, Semicorex SiC porous ceramic debonding chucks have numerous interconnected micro-pores uniformly distributed inside. With a porosity of 30 (±5)% and a pore size precisely controlled between 2-25 μm, Semicorex SiC porous ceramic debonding chucks can ensure that ultra-thin wafers are uniformly stressed during the debonding process, thus greatly lowering the risks of wafer warpage and breakage.

3.Precise flatness control

Benefiting from mature machining and surface treatment technologies, Semicorex SiC porous ceramic debonding chucks achieve parallelism controlled below 0.02mm and double-sided flatness below 0.02mm. This excellent flatness and parallelism provide a stable and flat support platform for the debonding process of ultra-thin wafers, effectively guaranteeing the accuracy and reliability of the debonding process.

4.Flexible dimension options

Semicorex SiC porous ceramic debonding chucks are well-suited for 6 inches and 8 inches wafer treatment and are available in various standard dimensions, including 159mm diameter × 0.75mm thickness, 200mm diameter × 1mm thickness, 204mm diameter × 1.5mm thickness.