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China silicon wafer polishing Manufacturers, Suppliers, Factory

"Sincerity, Innovation, Rigorousness, and Efficiency" could be the persistent conception of our organization for your long-term to establish alongside one another with shoppers for mutual reciprocity and mutual benefit for silicon wafer polishing,wafer polishing machine,silicon wafer lapping,double side polished silicon wafers,wafer holder, As a key business of this industry, our company makes endeavours to become a leading supplier, based on the faith of specialist quality & throughout the world company.
silicon wafer polishing, All the imported machines effectively control and guarantee the machining precision for the products. Besides, we have a group of high-quality management personnels and professionals, who make the high-quality products and have the ability to develop new products to expand our market home and abroad. We sincerely expect customers come for a blooming business for both of us.

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  • 8-inch Waferholder Rings

    8-inch Waferholder Rings

    Semicorex 8-inch Waferholder Rings are designed to provide precise wafer fixation and exceptional performance in aggressive thermal and chemical environments. Semicorex delivers application-specific engineering, tight dimensional control, and consistent SiC coating quality to meet the rigorous demands of advanced semiconductor processing.*
  • SiC Ceramic Boats

    SiC Ceramic Boats

    Semicorex SiC ceramic boats provide the optimal combination of purity, strength, thermal resistance, and dimensional accuracy required for the rigorous demands of modern semiconductor wafer processing. *
  • Semiconductor Wafer Carrier for MOCVD Equipment

    Semiconductor Wafer Carrier for MOCVD Equipment

    You can rest assured to buy Semiconductor Wafer Carrier for MOCVD Equipment from our factory. Semiconductor wafer carriers are an essential component of MOCVD equipment. They are used to transport and protect semiconductor wafers during the manufacturing process. Semiconductor Wafer Carriers for MOCVD Equipment are made of high-purity materials and are designed to maintain the integrity of the wafers during processing.
  • Solid SiC Shower Head

    Solid SiC Shower Head

    The Solid SiC Shower Head is a crucial component in semiconductor manufacturing, specifically designed for chemical vapor deposition (CVD) processes. Semicorex, a leader in advanced materials technology, offers Solid SiC Shower Heads that ensure superior distribution of precursor gases over substrate surfaces. This precision is vital for achieving high-quality and consistent processing results.**
  • 6 Inch N-type SiC Wafer

    6 Inch N-type SiC Wafer

    Semicorex provides various types of 4H and 6H SiC wafers. We have been manufacturer and supplier of wafers for many years. Our double-polished 6 Inch N-type SiC Wafer has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
  • CVD SiC Etching Ring Silicon Carbide

    CVD SiC Etching Ring Silicon Carbide

    Semicorex provide high-quality CVD SiC Etching Ring Silicon Carbide with customized service. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
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  • Research Progress of TaC Coatings on Carbon-Based Material Surfaces

    Carbon-based materials such as graphite, carbon fibers, and carbon/carbon (C/C) composites are known for their high specific strength, high specific modulus, and excellent thermal properties, making them suitable for a wide range of high-temperature applications. These materials are widely utilized in aerospace, chemical engineering, and energy storage. However, their susceptibility to oxidation and corrosion in high-temperature environments, along with poor scratch resistance, restricts their further application.

  • The Critical Role of SiC Substrates and Crystal Growth in the Semiconductor Industry

    Within the silicon carbide (SiC) industry chain, substrate suppliers hold significant leverage, primarily due to value distribution. SiC substrates account for 47% of the total value, followed by epitaxial layers at 23%, while device design and manufacturing constitute the remaining 30%. This inverted value chain stems from the high technological barriers inherent to substrate and epitaxial layer production. Three major challenges plague SiC substrate growth: stringent growth conditions, slow growth rates, and demanding crystallographic requirements. These complexities contribute to increased processing difficulty, ultimately resulting in low product yields and high costs. Furthermore, the epitaxial layer’s thickness and doping concentration are critical parameters directly impacting the final device performance.

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  • What is CMP Process

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