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China SiC Etching Substrate Manufacturers, Suppliers, Factory

The key to our success is "Good Products Good quality, Reasonable Price and Efficient Service" for SiC Etching Substrate,icp etching,GaN Plasma Etching,GaN Wet Etching,GaN Etch for LEDs, In order to expand our international market, we mainly supply our oversea customers Top quality performance products and service.
SiC Etching Substrate, At Current, our solutions have been exported to more than sixty countries and different regions, such as Southeast Asia, America, Africa, Eastern Europe, Russia, Canada etc. We sincerely hope to establish wide contact with all potential customers both in China and the rest part of the world.

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  • GaN-on-SiC Substrate

    GaN-on-SiC Substrate

    Semicorex graphite susceptor engineered specifically for epitaxy equipment with high heat and corrosion resistance in China. Our GaN-on-SiC Substrate susceptors have a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner in China.
  • SiC Wafer Boats

    SiC Wafer Boats

    Semicorex SiC Wafer Boats are advanced component meticulously designed for semiconductor manufacturing, specifically in diffusion and thermal processes. With our steadfast commitment to providing top-quality products at competitive prices, we are ready to become your long-term partner in China.*
  • SiC Ceramic Seal Ring

    SiC Ceramic Seal Ring

    The SiC Ceramic Seal Ring is renowned for its robust performance and durability. Semicorex offers high-quality SiC Ceramic Seal Rings that meet the stringent demands of modern industry. These rings have become indispensable in enhancing the efficiency and reliability of mechanical seals.**
  • Rigid Felt with Glass-like Carbon Coating

    Rigid Felt with Glass-like Carbon Coating

    Semicorex Rigid Felt with Glass-like Carbon Coating is a high-performance insulation material that combines the durability of carbon fiber felt with a scratch-resistant, dust-reducing glass-like carbon coating. Semicorex’s expertise in advanced coating technologies ensures exceptional durability and cleanliness, meeting the demands of high-temperature and precision-sensitive applications.*
  • High-Purity Quartz Crucibles

    High-Purity Quartz Crucibles

    Semicorex High-Purity Quartz Crucibles are critical component in the semiconductor industry, designed for the high-precision growth of single-crystal silicon. Semicorex's products, known for their exceptional quality and reliability, provide industry-leading solutions for the most demanding manufacturing processes.*
  • 4-inch SiC Boats

    4-inch SiC Boats

    Semicorex 4-Inch SiC Boats are high-performance wafer carriers designed for superior thermal and chemical stability in semiconductor manufacturing. Trusted by industry leaders, Semicorex combines advanced materials expertise with precision engineering to deliver products that enhance yield, reliability, and operational efficiency.*
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  • Tantalum carbide coatings in semiconductor industry

    The development of high-powered blue and UV LEDs has enabled the creation of full-color LED TV displays, as well as white LED automotive and domestic lighting. These LEDs are based on Gallium Nitride, which is deposited on substrate wafers supported by CVD SiC-coated graphite susceptor using the MOCVD process.

  • Advantages and Disadvantages of Gallium Nitride (GaN) Applications

    As the world looks for new opportunities in semiconductors, gallium nitride continues to stand out as a potential candidate for future power and RF applications. However, for all the benefits it offers, it still faces a major challenge; there are no P-type (P-type) products. Why is GaN touted as the next major semiconductor material, why is the lack of P-type GaN devices a major drawback, and what does this mean for future designs?

  • Core Material for SiC Growth: Tantalum Carbide Coating

    The current third-generation semiconductors are primarily based on Silicon Carbide, with substrates accounting for 47% of device costs, and epitaxy accounting for 23%, totaling approximately 70% and forming the most crucial part of the SiC device manufacturing industry.

  • Thin film growth process

    Common thin films are mainly divided into three categories: semiconductor thin films, dielectric thin films, and metal/metal compound thin films.

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  • Oxidation in Semiconductor Processing

    Oxidation processes play a critical role in preventing such problems by creating a protective layer on the wafer, known as the oxide layer, which acts as a barrier between different chemicals.

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