Microporous SiC Chuck

Semicorex Microporous SiC Chuck is a state-of-the-art vacuum chuck wafer designed for precision handling of wafers in semiconductor manufacturing applications. It acts as an essential part of picking, holding, and waft transport through the different stages of wafer processing which includes cleaning, etching, deposition, and lithography. This wafer chuck guarantees excellent grip and stability with the result that the wafer will be held securely during complex operations.

Semicorex Microporous SiC Chuck has a microporous surface structure; this is prepared from silicon carbide (SiC) of high quality and assures excellent thermal stability, chemical resistance, and long-term durability. It enables uniform suction force across the entire wafer surface, minimizing damage to the wafer while ensuring reliable handling throughout the processing cycle. Base materials offered include SUS430 stainless steel, aluminum alloy 6061, dense alumina ceramic, granite, and silicon carbide ceramic.

Features and Benefits

Microporous Surface Structure: The SiC chuck is designed with a microporous surface, enhancing the efficiency of vacuum absorption. This ensures that even delicate wafers are securely held in place without causing distortion or damage.

Material Versatility: The chuck base material is customizable to suit specific process needs:

• SUS430 Stainless Steel: Offers good corrosion resistance at an affordable price, ideal for standard applications.
• Aluminum Alloy 6061: Lightweight with high thermal conductivity, offering excellent heat dissipation for applications requiring high-temperature stability.
• Dense Alumina Ceramic (99% Al2O3): Provides exceptional electrical insulation and high temperature resistance, suitable for high-precision applications in semiconductor production.
• Granite: Known for its outstanding mechanical properties, granite offers excellent vibration damping, making it ideal for high-precision wafer handling where mechanical stability is essential.
• Silicon Carbide Ceramic: The ultimate choice for high thermal conductivity and resistance to thermal shock, providing long-lasting performance in demanding semiconductor environments.

Superior Flatness Accuracy: The chuck features exceptional flatness, essential for wafer handling precision. The flatness accuracy of the different base materials varies as follows:

Aluminum Alloy 6061: Best suited for applications requiring moderate flatness and lightweight.

SUS430 Stainless Steel: Offers good flatness, typically sufficient for most semiconductor processes.

Dense Alumina (99% Al2O3): Provides the highest flatness, ensuring precision wafer holding during sensitive processes.

Granite and SiC Ceramics: Both materials offer high flatness and excellent mechanical stability, providing superior accuracy for demanding wafer handling.

Customizable Weight: The chuck’s weight depends on the base material selected:

Aluminum Alloy 6061: The lightest material, ideal for processes that require frequent repositioning or handling.

Granite: Offers a moderate weight, providing solid stability without excessive mass.

Silicon Carbide and Alumina Ceramics: The heaviest materials, offering superior strength and rigidity for demanding applications.

High Precision and Stability: The SiC chuck ensures that wafers are handled with utmost precision, offering minimal wafer shifting or deformation during transportation through processing stages.

Applications in Semiconductor Manufacturing

The Microporous SiC Chuck is primarily used in wafer handling applications within semiconductor fabrication processes, including:

• Wafer Cleaning: Efficiently holds wafers during cleaning processes to ensure complete and uniform cleaning without causing damage.
• Etching and Lithography: Provides stable wafer holding during etching or lithography steps, ensuring precision and accuracy in patterning.
• Deposition: Secures wafers during physical vapor deposition (PVD) or chemical vapor deposition (CVD), crucial for thin-film coatings in semiconductor manufacturing.
• Inspection: Enables secure wafer holding during inspection stages, ensuring the wafer remains perfectly aligned and stable for high-resolution imaging or measurements.
• Packaging: Assists in the wafer packaging process, providing secure handling for wafers prior to or after chip separation.

Semicorex Microporous SiC Chuck is designed with the needs of modern semiconductor manufacturing in mind. Whether you require lightweight materials for easy repositioning or heavier, more rigid materials for precise handling, our chuck can be customized to fit your exact specifications. With a range of base material options, each offering unique benefits for specific processing needs, Semicorex delivers a product that combines precision, versatility, and durability. Additionally, the microporous surface ensures that wafers are held securely and uniformly, minimizing the risk of damage and ensuring quality handling across every process.

For semiconductor manufacturers looking for reliable, customizable, and high-performance wafer handling solutions, Semicorex Microporous SiC Chuck offers the perfect balance of precision, material flexibility, and long-lasting performance. With our product, you can be assured that your wafer handling process will be efficient, safe, and highly accurate.