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Our solutions are greatly recognized and reliable by customers and will fulfill continuously altering financial and social requirements for RTP/RTA SiC Coating Carrier,RTP ring,RTP/RTA,SiC Coated Graphite Susceptors,SiC Wafer Tray for RTP, Our enterprise warmly welcome close friends from everywhere in the environment to go to, examine and negotiate organization.
RTP/RTA SiC Coating Carrier, To create more creative goods, maintain high-quality goods and update not only our merchandise but ourselves so as to keep us ahead of the world, and the last but most vital one: to make every client satisfied with everything we provide and to grow stronger together. To be the real winner, starts here!

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    When cleaning wafers, ultrasonic cleaning and megasonic cleaning are commonly used to remove particles from the wafer surface.

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  • PECVD Process

    Plasma Enhanced Chemical Vapor Deposition (PECVD) is a widely used technology in chip manufacturing. It utilizes the kinetic energy of electrons within plasma to activate chemical reactions in the gas phase, thereby achieving thin-film deposition.

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