English
Home > Products > MOCVD Star Disc

China MOCVD Star Disc Manufacturers, Suppliers, Factory

Adhering towards the theory of "quality, support, efficiency and growth", we've attained trusts and praises from domestic and international client for MOCVD Star Disc,MOCVD Reactor Susceptors,Veeco MOCVD Susceptor,SiC-Coated MOCVD Reactor Part,MOCVD Ceiling, We are expecting to cooperate with you on the basis of mutual benefits and common development. We will never disappoint you.
MOCVD Star Disc, Based on experienced engineers, all orders for drawing-based or sample-based processing are welcomed. We have won a good reputation for outstanding customer service among our overseas customers. We will continue to try the best to offer you good quality products and the best service. We are looking forward to serving you.

Related Products

Hot Products

  • Single-crystal Silicon Epi Susceptor

    Single-crystal Silicon Epi Susceptor

    The Single-crystal Silicon Epi Susceptor is an essential component designed for Si-GaN epitaxy processes, which can be tailored to individualized specifications and preferences, providing a bespoke solution that aligns perfectly with specific requirements. Whether it entails modifications in dimensions or adjustments in coating thickness, we possess the capability to design and deliver a product that accommodates diverse process parameters, thereby optimizing performance for targeted applications. Semicorex’s commitment to market-leading quality, allied with competitive fiscal considerations, cements our eagerness to establish partnerships in fulfilling your semiconductor wafer conveyance requisites.
  • SiC Ceramic Chuck

    SiC Ceramic Chuck

    Semicorex SiC Ceramic Chuck is a highly specialized component designed for use in semiconductor epitaxial processes, where its role as a vacuum chuck is crucial. With our commitment to delivering top-quality products at competitive prices, we are poised to be your long-term partner in China.*
  • Al2O3 Substrate

    Al2O3 Substrate

    Semicorex proudly presents the Al2O3 Substrate, a versatile and high-performance material crafted from high-purity aluminum oxide (alumina). This advanced ceramic substrate is lauded for its exceptional properties, making it a cornerstone in various high-tech industries, including electronics, optoelectronics, and solid oxide fuel cells.**
  • SiC Ceramic Seal Part

    SiC Ceramic Seal Part

    Semicorex SiC Ceramic Seal Part stands as a testament to cutting-edge materials science and engineering prowess, designed to meet the exacting demands of high-performance mechanical sealing applications across a variety of industries.**
  • SiC Coated Graphite Base Susceptors for MOCVD

    SiC Coated Graphite Base Susceptors for MOCVD

    Semicorex SiC Coated Graphite Base Susceptors for MOCVD are superior quality carriers used in the semiconductor industry. Our product is designed with high-quality silicon carbide that provide excellent performance and long-lasting durability. This carrier is ideal for use in the process of growing an epitaxial layer on the wafer chip.
  • Custom SiC Cantilever Paddle

    Custom SiC Cantilever Paddle

    Semicorex Custom SiC Cantilever Paddle has become an indispensable component in the photovoltaic industry, playing a critical role in the efficient and precise handling of silicon wafers during high-temperature diffusion processes. The Custom SiC Cantilever Paddle, meticulously engineered from high-performance silicon carbide (SiC) ceramics, offers a unique blend of properties essential for maintaining wafer integrity, ensuring process uniformity, and maximizing productivity in demanding diffusion furnace environments.**
  • Related Blog
  • Reviews

  • A Review of 9 Sintering Techniques for Silicon Carbide Ceramics

    Silicon carbide (SiC), a prominent structural ceramic, is renowned for its exceptional properties, including high-temperature strength, hardness, elastic modulus, wear resistance, thermal conductivity, and corrosion resistance. These attributes make it suitable for a wide range of applications, from traditional industrial uses in high-temperature kiln furniture, burner nozzles, heat exchangers, sealing rings, and sliding bearings, to advanced applications like ballistic armor, space mirrors, semiconductor wafer chucks, and nuclear fuel cladding.

  • SiGe and Si Selective Etching Technology

    A critical step in the fabrication of n-type GAAFETs involves the high-selectivity etching of SiGe:Si stacks prior to the deposition of inner spacers, generating silicon nanosheets and releasing channels.

  • Why Doesn’t Gllium Nitride (GaN) Epitaxy Grow on a GaN substrate?

    The growth of GaN epitaxy on GaN substrate presents a unique challenge, despite the material’s superior properties when compared to silicon. GaN epitaxy offers significant advantages in terms of band gap width, thermal conductivity, and breakdown electric field over silicon-based materials. This makes the adoption of GaN as the backbone for the third generation of semiconductors, which provide enhanced cooling, lower conduction loss, and improved performance under high temperatures and frequencies, a promising and crucial advancement for the photonic and micro-electronic industries.

  • Demystifying Electrostatic Chuck (ESC) Technology in Wafer Handling

    Electrostatic chucks (ESCs) have become indispensable in semiconductor manufacturing and flat panel display production, offering a damage-free, highly controllable method for holding and positioning delicate wafers and substrates during critical processing steps. This article delves into the intricacies of ESC technology, exploring its principles of operation, various adhesion mechanisms, and fundamental structural components.

  • GaN vs SiC

    There are several materials currently under investigation, among which silicon carbide stands out as one of the most promising. Similar to GaN, it boasts higher operating voltages, higher breakdown voltages, and superior conductivity compared to silicon. Moreover, thanks to its high thermal conductivity, silicon carbide can be utilized in environments with extreme temperatures. Lastly, it is significantly smaller in size yet capable of handling greater power.

  • Why Use Ultrasonic Cleaning in Semiconductor Manufacturing

    When cleaning wafers, ultrasonic cleaning and megasonic cleaning are commonly used to remove particles from the wafer surface.

Send Inquiry

Hit enter to search or ESC to close
X
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept