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  • SiC Chuck

    SiC Chuck

    Semicorex SiC Chuck, or Silicon Carbide Chuck, is a specialized component primarily used in semiconductor manufacturing and precision machining applications. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Silicon Carbide Wafer Chuck

    Silicon Carbide Wafer Chuck

    The Semicorex Silicon Carbide Wafer Chuck is an essential component in the semiconductor epitaxial process. It serves as a vacuum chuck to securely hold wafers during critical manufacturing stages. We are committed to delivering top-quality products at competitive prices, positioning ourselves to be your long-term partner in China.*
  • Bulk SiC Ring

    Bulk SiC Ring

    Semicorex Bulk SiC Ring is a crucial component in semiconductor etching processes, specifically designed for use as an etching ring within advanced semiconductor manufacturing equipment. With our steadfast commitment to providing top-quality products at competitive prices, we are ready to become your long-term partner in China.*
  • CVD SiC Focus Ring

    CVD SiC Focus Ring

    Through a process of chemical vapor deposition (CVD), Semicorex CVD SiC Focus Ring is meticulously deposited and mechanically processed to achieve the final product. With its superior material properties, it's indispensable in the demanding environments of modern semiconductor fabrication.**
  • SiC Robot hands

    SiC Robot hands

    Semicorex SiC Robot Hands are high-precision, ultra-clean end-effectors designed for safe and reliable wafer transfer in semiconductor manufacturing.Choose Semicorex for industry-leading expertise in advanced ceramics, delivering superior performance, purity, and customization trusted by top semiconductor fabs worldwide.*
  • Horizontal Chamber Furnace SiC boats

    Horizontal Chamber Furnace SiC boats

    Semicorex Horizontal Chamber Furnace SiC Boats are high-purity silicon carbide carrier designed for secure wafer holding during high-temperature horizontal furnace processing. Choosing Semicorex means benefiting from precise engineering, exceptional durability, and superior thermal performance for consistent, high-yield production.*
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  • Reviews

  • Dislocation in SiC crystals

    SiC substrate can have microscopic defects, such as Threading Screw Dislocation (TSD), Threading Edge Dislocation (TED), Base Plane Dislocation (BPD), and others. These defects are caused by deviations in the arrangement of atoms at the atomic level.

  • Substrate vs. Epitaxy: Key Roles in Semiconductor Manufacturing

    ​In the realms of semiconductor technology and microelectronics, the concepts of substrates and epitaxy hold significant importance. They play critical roles in the manufacturing process of semiconductor devices. This article will delve into the differences between semiconductor substrates and epitaxy, covering their definitions, functions, material structures, and application areas.

  • How to do CMP Process

    In the process of silicon wafer manufacturing, after the crystal rod is cut into silicon wafers, it will need to be polished and cleaned to obtain a single crystal silicon wafer like a mirror.

  • Substrate and Epitaxy

    In the process of wafer preparation, there are two core links: one is the preparation of the substrate, and the other is the implementation of the epitaxial process. The substrate, a wafer carefully made of semiconductor single crystal material, can be directly put into the wafer manufacturing process as a basis to produce semiconductor devices, or further enhance the performance through the epitaxial process.

  • Application of GaN

    There are many types of gallium nitride (GaN), with silicon-based GaN being the most discussed. This technology involves growing GaN materials directly on a silicon substrate.

  • Semiconductor doping process

    One of the unique properties of semiconductor materials is that their conductivity, as well as their conductivity type (N-type or P-type), can be created and controlled through a process called doping. This involves introducing specialized impurities, known as dopants, into the material to form junctions on the surface of the wafer. The industry employs two main doping techniques: thermal diffusion and ion implantation.

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