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epitaxy of semiconductors, In order to make more people know our items and to enlarge our market, we've got devoted a lot of attention to technical innovations and improvement, as well as replacement of equipment. Last but not the least, we also pay more attention to training our managerial personnel, technicians and workers in planned way.

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  • ZrO2 Crucible

    ZrO2 Crucible

    Semicorex ZrO2 Crucible is crafted from stabilized zirconia ceramic, presenting a standard composition of 94.7% zirconium dioxide (ZrO2) and 5.2% yttrium oxide (Y2O3) by weight percentage, or alternatively, 97% ZrO2 and 3% Y2O3 by mol percentage. This precise formulation endows the ZrO2 Crucible with a suite of advantageous characteristics that cater specifically to the demands of high-performance industrial processes.**
  • TaC Coated Planetary Susceptor

    TaC Coated Planetary Susceptor

    Semicorex TaC Coated Planetary Susceptor is a highly specialized component designed for use in the epitaxial processes of semiconductor manufacturing. Semicorex is dedicated to delivering top-quality products at competitive prices. We are eager to establish a long-term partnership with you in China.*
  • PSS Etching Carrier Tray for LED

    PSS Etching Carrier Tray for LED

    At Semicorex, we have designed the PSS Etching Carrier Tray for LED specifically for the harsh environments required for epitaxial growth and wafer handling processes. Our ultra-pure graphite carrier is ideal for thin-film deposition phases like MOCVD, epitaxy susceptors, pancake or satellite platforms, and wafer handling processing such as etching. The SiC coated carrier has high heat and corrosion resistance, excellent heat distribution properties, and a high thermal conductivity. Our PSS Etching Carrier Tray for LED is cost-effective and offer a good price advantage. We cater to many European and American markets and look forward to becoming your long-term partner in China.
  • Graphite Carrier for Epitaxial Reactors

    Graphite Carrier for Epitaxial Reactors

    Semicorex Graphite Carrier for Epitaxial Reactors is a SiC coated graphite component with precision micro-holes for gas flow, optimized for high-performance epitaxial deposition. Choose Semicorex for superior coating technology, customization flexibility, and industry-trusted quality.*
  • Wafer Carrier Handles

    Wafer Carrier Handles

    Semicorex Wafer Carrier Handles, made from high-quality PFA material, are designed for the safe and efficient transport of semiconductor wafers within wafer cassettes. Choose Semicorex for our commitment to providing durable, high-purity components that ensure superior performance and reliability in semiconductor manufacturing processes.*
  • AlN Ceramic Crucible

    AlN Ceramic Crucible

    Designed to withstand extreme conditions, the AlN Ceramic Crucible presented by Semicorex is an indispensable tool for professionals working with non-ferrous metals and semiconductor materials like gallium arsenide.
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  • Reviews

  • Knowing GaN

    Recently, the semiconductor industry has continued to pay increasing attention to Gallium Nitride (GaN) technology. Due to its excellent electronic properties, Gallium Nitride devices have important applications in many high-tech fields:

  • What are the applications of silicon carbide ceramic membranes

    Silicon carbide ceramic membranes have significant advantages in the fields of water treatment and industrial separation, and their application scenarios are wide-ranging.

  • 3 methods of graphite molding

    The four main molding methods for graphite molding are: extrusion molding, molding, vibratory molding and isostatic molding. Most of the common carbon/graphite materials on the market are molded by hot extrusion and molding (cold or hot), and isostatic molding is a method with leading molding performance. Vibration molding is generally used to manufacture medium and coarse structural graphite, particle size between 0.5-2mm particle size, generally dominated by di-roasted graphitized products, density between 1.55-1.75kg/m³, coarser particles, rougher surface, can not be used for precision machining. It is mainly used in chemical industry and metal smelting.

  • Discussing CVD furnace

  • What is a MOCVD system?

  • Thin film growth process

    Common thin films are mainly divided into three categories: semiconductor thin films, dielectric thin films, and metal/metal compound thin films.

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