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E-chuck, Our company regards "reasonable prices, efficient production time and good after-sales service" as our tenet. We hope to cooperate with more customers for mutual development and benefits. We welcome potential buyers to contact us.

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  • Gas Inlet Ring for Semiconductor Equipment

    Gas Inlet Ring for Semiconductor Equipment

    Semicorex is a large-scale manufacturer and supplier of Silicon Carbide Coated Graphite Susceptor in China. We focus on semiconductor industries such as silicon carbide layers and epitaxy semiconductor. Our Gas Inlet Ring for Semiconductor Equipment has a good price advantage and cover many of the European and American markets. We look forward to becoming your long-term partner in China.
  • CVD shower head with SiC Coat

    CVD shower head with SiC Coat

    Semicorex CVD shower head with SiC Coat represents an advanced component engineered for precision in industrial applications, notably within the realms of chemical vapor deposition (CVD) and plasma-enhanced chemical vapor deposition (PECVD). Serving as a critical conduit for the delivery of precursor gases or reactive species, this specialized CVD shower head with SiC Coat facilitates the precise deposition of materials onto a substrate’s surface, integral to these sophisticated manufacturing processes.
  • SiC Diffusion Furnace Tube

    SiC Diffusion Furnace Tube

    The advanced material properties of Semicorex SiC Diffusion Furnace Tube, including high flexural strength, outstanding oxidation and corrosion resistance, high wear resistance, low friction coefficient, superior high-temperature mechanical properties, and ultra-high purity, make it indispensable in the semiconductor industry, particularly for diffusion furnace applications. We at Semicorex are dedicated to manufacturing and supplying high-performance SiC Diffusion Furnace Tube that fuse quality with cost-efficiency.**
  • Horizontal SiC Wafer Boat

    Horizontal SiC Wafer Boat

    Semicorex Horizontal SiC Wafer Boat has emerged as an indispensable tool in the production of high-performance semiconductor and photovoltaic devices. These specialized carriers, meticulously engineered from high-purity silicon carbide (SiC), offer exceptional thermal, chemical, and mechanical properties essential for the demanding processes involved in fabricating cutting-edge electronic components.**
  • LPE Part

    LPE Part

    Semicorex LPE Part is a SiC-coated component specifically designed for the SiC epitaxy process, offering exceptional thermal stability and chemical resistance to ensure efficient operation in high-temperature and harsh environments. By choosing Semicorex products, you benefit from high-precision, long-lasting custom solutions that optimize the SiC epitaxy growth process and enhance production efficiency.*
  • CCM Brakes

    CCM Brakes

    Semicorex CCM Brakes, made from advanced carbon-ceramic matrix materials, are the ideal solution for high-performance braking in extreme driving environments. Choose Semicorex for our unmatched expertise in ceramic composite engineering, precision manufacturing, and commitment to delivering consistent, race-proven quality.*
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    As a wide-bandgap (WBG) semiconductor material, SiC's wider energy difference gives it higher thermal and electronic properties compared to traditional Si. This feature enables power devices to operate at higher temperatures, frequencies and voltages.

  • Porous Graphite for SiC Crystal Growth

    Currently, most SiC substrate manufacturers use a new crucible thermal field process design with porous graphite cylinders: placing high-purity SiC particle raw materials between the graphite crucible wall and the porous graphite cylinder, while deepening the entire crucible and increasing the crucible diameter.

  • Challenges of Ion Implantation Technology in SiC and GaN Power Devices

    Wide bandgap (WBG) semiconductors such as Silicon Carbide (SiC) and Gallium Nitride (GaN) are expected to play an increasingly important role in power electronic devices. They offer several advantages over traditional Silicon (Si) devices, including higher efficiency, power density, and switching frequency. Ion implantation is the primary method for achieving selective doping in Si devices. However, there are some challenges when applying it to wide bandgap devices. In this article, we will focus on some of these challenges and summarize their potential applications in GaN power devices.

  • Substrate and Epitaxy

    In the process of wafer preparation, there are two core links: one is the preparation of the substrate, and the other is the implementation of the epitaxial process. The substrate, a wafer carefully made of semiconductor single crystal material, can be directly put into the wafer manufacturing process as a basis to produce semiconductor devices, or further enhance the performance through the epitaxial process.

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