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We generally continually give you quite possibly the most conscientious shopper company, and the widest variety of designs and styles with finest materials. These endeavours include the availability of customized designs with speed and dispatch for Ceramic Seal,Industrial Seal,Graphite Seal,Sic Mechanical Seal,Ceramic Seal Parts, We welcome buyers everywhere in the word to get in touch with us for future business enterprise interactions. Our merchandise are the most effective. Once Selected, Ideal Forever!
Ceramic Seal, Our business activities and processes are engineered to make sure our customers have access to widest range of products with the shortest supply time lines. This achievement is made possible by our highly skilled and experienced team. We look for people who want to grow with us around the globe and stand out from the crowd. We now have people who embrace tomorrow, have vision, love stretching their minds and going far beyond what they thought was achievable.

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    SiC Carrier for ICP

    Semicorex SiC Carrier for ICP is a high-performance wafer holder made of SiC-coated graphite, designed specifically for use in inductively coupled plasma (ICP) etching and deposition systems. Choose Semicorex for our world-leading anisotropic graphite quality, precision small-batch manufacturing, and uncompromising commitment to purity, consistency, and process performance.*
  • Silicon Wafer

    Silicon Wafer

    Semicorex silicon wafer is a thin, circular slice of silicon crystal used in the fabrication of integrated circuits and other microdevices. Typically, these wafers are produced through a meticulous process involving growing a single crystal ingot of high-purity silicon and then precisely slicing it into thin discs. Silicon wafers serve as the fundamental substrate upon which semiconductor devices are built. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Metallic Shower Head

    Metallic Shower Head

    The Metallic Shower head, known as a gas distribution plate or gas shower head, is a critical component extensively utilized in semiconductor manufacturing processes.Its primary function is to evenly distribute gases into a reaction chamber, ensuring that semiconductor materials come into uniform contact with process gases.**
  • Glassy Carbon Coating Felt

    Glassy Carbon Coating Felt

    Semicorex Glassy Carbon Coating Felt is a premium-grade insulation material designed to deliver exceptional thermal performance and process cleanliness in SiC epitaxial growth systems. Choose Semicorex for unmatched expertise in engineered carbon solutions, consistent product quality, and a deep commitment to supporting next-generation semiconductor manufacturing.*
  • Fused Quartz Crucible

    Fused Quartz Crucible

    Premium Fused Quartz Crucible, meticulously crafted from semiconductor-grade quartz to meet the exacting standards of the semiconductor industry. Engineered for precision and durability, this crucible is an indispensable tool for semiconductor processing, ensuring the utmost reliability in your critical applications. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Tantalum Carbide Halfmoon Part

    Tantalum Carbide Halfmoon Part

    Semicorex Tantalum Carbide Halfmoon Part is a crucial component utilized in the semiconductor epitaxy process, a critical stage in the manufacturing of semiconductor devices. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China*.
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  • Doping Control in Sublimation SiC Growth

    Silicon carbide (SiC) plays an important role in manufacturing power electronics and high-frequency devices due to its excellent electrical and thermal properties. The quality and doping level of SiC crystals directly affect the performance of the device, so precise control of doping is one of the key technologies in the SiC growth process.

  • Defect Detection in Silicon Carbide Wafer Processing

    SiC substrates are the most crucial component in the silicon carbide industry, accounting for nearly 50% of its value. Without SiC substrates, it is impossible to manufacture SiC devices, making them the essential material foundation.

  • TaC Coating Crucible for AlN Crystal Growth

    The third generation of semiconductor materials AlN belongs to the direct bandgap semiconductor, its bandwidth of 6.2 eV, with high thermal conductivity, resistivity, breakdown field strength, as well as excellent chemical and thermal stability, is not only an important blue light, ultraviolet materials, or electronic devices and integrated circuits, important packaging, dielectric isolation and insulation materials, especially for high-temperature high-power devices. In addition, AlN and GaN have a good thermal match and chemical compatibility, AlN used as GaN epitaxial substrate, can significantly reduce the defect density in GaN devices, improve device performance.

  • Funds on Semiconductor projects

    Every country is aware of the importance of chips and is now accelerating the construction of its own chip manufacturing supply chain ecosystem to prevent another chip shortage problem. But the advanced foundries without next-gen chip designers would be the same as “Fabs without Chips”.

  • What is cantilever paddles?

    The wafer boats, loaded with a batch of wafers to be processed, are positioned on long cantilevered paddles.

  • Understanding Dry Etching Technology in the Semiconductor Industry

    Currently, many semiconductor devices employ mesa device structures, which are predominantly created through two types of etching: wet etching and dry etching. While the simple and rapid wet etching plays a significant role in semiconductor device fabrication, it has inherent drawbacks such as isotropic etching and poor uniformity, which result in limited control when transferring small-sized patterns. Dry etching, however, with its high anisotropy, good uniformity, and repeatability, has become prominent in semiconductor device fabrication processes. The term “dry etching” broadly refers to any non-wet etching technology used for removing surface materials and transferring micro and nano patterns, including laser etching, plasma etching, and chemical vapor etching. The dry etching discussed in this text specifically pertains to the narrow application of processes using plasma discharge—either physical or chemical—to modify material surfaces.

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