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The Core Parameters in Dry Etching

Dry etching is a main technology in the manufacturing processes of micro-electro-mechanical systems. The performance of dry etching process exerts a direct influence on the structural precision and operational performance of semiconductor devices. To precisely control the etching process, the close ......

Why do the sidewalls bend during dry etching

Dry etching is typically a process combining physical and chemical actions, with ion bombardment being a crucial physical etching technique. During etching, the incident angle and energy distribution of ions can be uneven.

What is the silicon carbide aerostatic slideway？

Silicon carbide aerostatic slideway is an advanced guideway system that combines the material properties of silicon carbide and aerostatic technology. Servicing as the optimal solution for high-precision, high-reliability and long-term motion systems, silicon carbide aerostatic slideway is widely us......

SiC Crystals Prepared by PVT Method

The mainstream method for preparing silicon carbide single crystals is the physical vapor transport (PVT) method. This method mainly consists of a quartz tube cavity, a heating element (induction coil or graphite heater), graphite carbon felt insulation material, a graphite crucible, a silicon carbi......

What is SOI？

SOI, short for Silicon-On-Insulator, is a semiconductor manufacturing process based on special substrate materials. Since its industrialization in the 1980s, this technology has become an important branch of advanced semiconductor manufacturing processes. Distinguished by its unique three-layer com......

Surface Treatment For High-end Electrostatic Chuck

The electrostatic Chuck undertakes multiple functions such as uniform electrostatic discharge, heat conduction and wafer adsorption and fixation in the field of semiconductor manufacturing. One of the core functions of the ESC is to stably adsorb wafers under extreme operating conditions such as hig......

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