Temporary bonding and debonding technologies are typically applied to guarantee the stable performance and production yield of semiconductor devices. The ultra-thin wafer is temporarily fixed onto a rigid carrier substrate, and after backside processing, the two are separated. This separation proces......
Read MoreIn semiconductor manufacturing, oxidation involves placing the wafer in a high-temperature environment where oxygen flows across the wafer surface to form an oxide layer. This protects the wafer from chemical impurities, prevents leakage current from entering the circuitry, prevents diffusion during......
Read MoreQuartz belongs to trigonal crystal system, which is a three-dimensional framework mineral crystal composed of silicon dioxide. Typically, pure quartz is colorless and transparent, but it takes on a variety of hues as a result of trace pigment ions, finely dispersed inclusions or the formation of col......
Read MoreSiC material is not composed of a single tetrahedron of one Si atom and one C atom, but of countless Si and C atoms. A large number of Si and C atoms form undulating double atomic layers (one layer of C atoms and one layer of Si atoms), and numerous double atomic layers stack to form SiC crystals. D......
Read MoreThe manufacturing and processing of high-quality silicon carbide substrates involve extremely high technical barriers. Numerous challenges persist across the entire process, from raw material preparation to finished product fabrication, which has become a crucial factor restricting its large-scale ......
Read MoreCarbon-ceramic brake discs are high-performing brake solutions precisely made of carbon fiber-reinforced silicon carbide-based composite materials, whose technical origins can be traced back to aircraft braking field in the 1970s. Leveraging the high strength and toughness of carbon fiber and the hi......
Read More