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How Does TaC Coating Protect Graphite Components In Semiconductors

That's where the game-changing innovation of TaC Coating enters the picture, and why our advanced solutions at Semicorex are engineered to directly address your most persistent production pain points. Graphite is fantastic for its thermal properties, but without a robust shield, it simply cannot wit......

Etching and Etched Morphology

In the semiconductor chip manufacturing process, we are like building a skyscraper on a grain of rice. The lithography machine is like a city planner, using "light" to draw the blueprint for the building on the wafer; while etching is like a sculptor with precision tools, responsible for accurately ......

What are dishing and erosion in the CMP process?

Chemical mechanical polishing (CMP), which combines chemical corrosion and mechanical polishing to remove surface imperfections, is the significant semiconductor process for achieving overall planarization of the wafer surface. CMP results in two surface defects, dishing and erosion, which significa......

Why is CO2 introduced During the Wafer Saw Process

Introducing CO₂ to the dicing water is a significant technical measure in wafer saw process to suppress static electricity accumulation and reduce contamination, thereby improving the dicing yield and reliability of the chips.

What is Self-lubricating Bushing

Self-lubricating bushing, is a general name for a large category of products - the bushings that can achieve lubrication without adding extra lubricant, also the self-lubricating bearings include oil-impregnated bushings and composite bushings. The core principle is to automatically release the lubr......

What is Silicon Epitaxy Process?

Silicon epitaxy is a primary fabrication process for integrated circuits. It allows IC devices to be fabricated on lightly doped epitaxial layers with heavily doped buried layers, while also forming grown PN junctions, thus solving the isolation problem of ICs. Silicon epitaxial wafers are also a pr......

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