Wafer bonding is a vital important technology in semiconductor manufacturing. It uses physical or chemical methods to bond two smooth and clean wafers together to achieve specific functions or assist in the semiconductor manufacturing process. It is an technology to promote the development of se......
Read MoreRecrystallized silicon carbide is a high-performance ceramic formed by combining SiC particles through an evaporation-condensation mechanism to form a strong solid-phase sintered body. Its most notable feature is that no sintering aids are added, and the final product is almost pure silicon carbide,......
Read MoreIn chip manufacturing, photolithography and etching are two closely linked steps. Photolithography precedes etching, where the circuit pattern is developed on the wafer using photoresist. Etching then removes the film layers not covered by the photoresist, completing the transfer of the pattern from......
Read MoreWafer dicing is the final step in the semiconductor manufacturing process, separating silicon wafers into individual chips (also called dies). Plasma dicing uses a dry etching process to etch away the material in the dicing streets through fluorine plasma to achieve the separation effect. With the a......
Read MoreThe new energy vehicle industry is quickly advancing toward high-quality growth, becoming an eagerly awaited part of the global supply chain. The automotive power module acts as the "power center" of new energy vehicles, responsible for converting the battery's DC power into the AC needed to operate......
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