Wafer cleaning refers to the process of removing particulate contaminants, organic contaminants, metal contaminants, and natural oxide layers from the wafer surface using physical or chemical methods before semiconductor processes such as oxidation, photolithography, epitaxy, diffusion, and wire eva......
Read MoreSilicon carbide ceramics are among the most widely used materials in structural ceramics. Due to their relatively low thermal expansion, high specific strength, high thermal conductivity and hardness, wear resistance and corrosion resistance, and most importantly, their ability to maintain good perf......
Read MoreSemiconductor materials are the materials with electrical conductivity between conductors and insulators at room temperature, which are widely used in fields like integrated circuits, communications, energy and optoelectronics. With development of technology, semiconductor materials have evolved fro......
Read MoreFocus rings are the essential components to ensure the uniformity and stability of the semiconductor etching processes. Through precise control of electric and thermal fields, focus rings can concentrate plasma on the wafer surface, ensuring consistent etching results across all locations on the waf......
Read MoreSilicon carbide has good chemical stability and can withstand various highly corrosive acidic and alkaline media, making it suitable for mechanical seals in corrosive media. Corrosive wear is a major form of failure for friction pair materials. Hot-pressed sintered silicon carbide forms a protective......
Read MoreParticle defects refer to the tiny particulate inclusions inside or on the semiconductor wafers. They can damage the structural integrity of semiconductor devices and cause electrical faults such as short circuits and open circuits. Since these problems caused by particle defects can seriously af......
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