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    Semicorex Tantalum Carbide Halfmoon Part is a crucial component utilized in the semiconductor epitaxy process, a critical stage in the manufacturing of semiconductor devices. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China*.
  • SiC O Ring

    SiC O Ring

    Semicorex SiC O Ring is highly valued in a range of industries for their exceptional sealing capabilities and material properties. Its use spans applications where extreme conditions such as high temperatures, aggressive chemicals, mechanical stress, and stringent cleanliness are routine.**
  • CCM Brakes

    CCM Brakes

    Semicorex CCM Brakes, made from advanced carbon-ceramic matrix materials, are the ideal solution for high-performance braking in extreme driving environments. Choose Semicorex for our unmatched expertise in ceramic composite engineering, precision manufacturing, and commitment to delivering consistent, race-proven quality.*
  • Wafer Boats

    Wafer Boats

    Semicorex wafer boats are precision-engineered ceramic carriers designed for high-temperature wafer processing in semiconductor manufacturing. Choose Semicorex for its unmatched material purity, advanced fabrication technology, and commitment to quality that ensures consistent performance in the most demanding cleanroom environments.*
  • Solid SiC Shower Head

    Solid SiC Shower Head

    The Solid SiC Shower Head is a crucial component in semiconductor manufacturing, specifically designed for chemical vapor deposition (CVD) processes. Semicorex, a leader in advanced materials technology, offers Solid SiC Shower Heads that ensure superior distribution of precursor gases over substrate surfaces. This precision is vital for achieving high-quality and consistent processing results.**
  • Alumina Ceramic Flanges

    Alumina Ceramic Flanges

    Alumina Ceramic Flanges are engineered components that offer substantial benefits, particularly in settings where thermal stability, weight considerations, and corrosion resistance are of paramount importance. These flanges are not only durable and reliable but also contribute to the overall efficiency and cost-effectiveness of the systems in which they are employed. Their unique properties make them an excellent choice for advanced engineering solutions in various industrial sectors.We at Semicorex are dedicated to manufacturing and supplying high-performance Alumina Ceramic Flanges that fuse quality with cost-efficiency.**
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  • Advantages of Silicon Carbide Ceramics in the Optical Fiber Industry

    Silicon carbide ceramics offer numerous advantages in the optical fiber industry, including high-temperature stability, low thermal expansion coefficient, low loss and damage threshold, mechanical strength, corrosion resistance, good thermal conductivity, and low dielectric constant. These properties make SiC ceramics an ideal material for fiber optic sensors, lasers, and high-power optical fiber applications. As demand in the optical fiber field increases, the application prospects for silicon carbide ceramics will become increasingly prominent.

  • Synthesizing High-Purity Silicon Carbide Powder

    High-Purity Silicon Carbide Powder features exceptional wide bandgap characteristics, which make it an ideal material for manufacturing high-frequency, high-power electronic devices.

  • How Are Ceramic Electrostatic Chucks Actually Produced?

    In semiconductor manufacturing, the precision and stability of the etching process are paramount. One critical factor in achieving high-quality etching is ensuring that wafers are perfectly flat on the tray during the process. Any deviation can lead to uneven ion bombardment, causing undesirable angles and variations in etching rates. To address these challenges, engineers have developed Electrostatic Chucks (ESCs), which have significantly improved etching quality and stability. This article delves into the design and functionality of ESCs, focusing on one key aspect: the electrostatic principles behind wafer adhesion.

  • Dry Etching vs Wet Etching

    In semiconductor fabrication, etching is one of the major steps, along with photolithography and thin-film deposition. It involves removing unwanted materials from the surface of a wafer using chemical or physical methods. This step is carried out after coating, photolithography, and developing. It is used to remove the exposed thin film material, leaving only the desired portion of the wafer, and then removing the excess photoresist. These steps are repeated numerous times to create complex integrated circuits.

  • Electronic Grade Silicon Carbide Powder

    As the core material of the third-generation semiconductors, silicon carbide (SiC) is playing an increasingly important role in high-tech fields such as new energy vehicles, photovoltaic energy storage, and 5G communications due to its excellent physical properties.

  • Introducing Gallium Oxide(Ga2O3)

    Gallium oxide (Ga2O3) as an "ultra-wide bandgap semiconductor" material has garnered sustained attention. Ultra-wide bandgap semiconductors fall under the category of "fourth-generation semiconductors," and in comparison to third-generation semiconductors such as silicon carbide (SiC) and gallium nitride (GaN), gallium oxide boasts a bandgap width of 4.9eV, surpassing silicon carbide's 3.2eV and gallium nitride's 3.39eV. A wider bandgap implies that electrons require more energy to transition from the valence band to the conduction band, endowing gallium oxide with characteristics like high voltage resistance, high-temperature tolerance, high power capability, and radiation resistance.

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