Products

Semicorex SiC porous ceramic debonding chucks are the essential components specially designed for adsorption and fixation of thinned ultra-thin wafers in advanced semiconductor manufacturing. Semicorex is committed to offering the precision-machined SiC porous ceramic chucks with market-leading quality for our distinguished customers.

Semicorex SiC porous ceramic vacuum chucks are the highly specialized ceramic fixtures that utilize the special structure of porous silicon carbide ceramic materials to achieve vacuum adsorption of workpieces. Leveraging state-of-the-art production technologies and mature manufacturing experience, Semicorex is committed to providing our valued customers with market-leading quality SiC porous ceramic vacuum chucks.

Semicorex microporous ceramic chuck is engineered to provide uniform, stable vacuum holding for precision manufacturing processes where flatness, cleanliness, and repeatability are critical. Designed for OEM integration, Semicorex leverages advanced ceramic materials and controlled microporous structures to deliver reliable chucking performance across demanding industrial applications.*

Customized porous ceramic chuck is the superior workpiece clamping and fixing solution designed exclusively for semiconductor manufacturing. Selecting Semicorex means you will benefit from reliable quality, customization services and increased productivity.

Semicorex Porous Ceramic Chuck (Vacuum Chuck) is a high-precision tool designed to securely hold wafers during semiconductor manufacturing processes. By choosing Semicorex, you benefit from a solution that offers exceptional performance, durability, and customization options, ensuring enhanced production efficiency and consistent quality standards.*

Semicorex Porous Ceramic Vacuum Chuck's primary function lies in its ability to provide uniform air and water permeability, a feature that ensures the even distribution of stress and robust adhesion of silicon wafers. This characteristic is crucial during the grinding process, as it prevents the wafer from slipping, thereby maintaining the integrity of the operation.**