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Silicon, Silicon Carbide and Gallium Nitride

Behind the common used digital products and high-tech electric vehicles, 5G base station, there are 3 core semiconductor materials: Silicon, Silicon Carbide and Gallium Nitride driving the industry. They are not alternative for each other, they are the experts in a team, and have the irreplaceable e......

What is the notch on wafers?

The wafer notch is a V-shaped or U-shaped groove on the edge of a semiconductor wafer. Far from being a defect incurred during the manufacturing process, it is the critical structural marker that was intentionally designed, whose core function lies in enabling precise positioning and orientation ide......

How Does TaC Coating Protect Graphite Components In Semiconductors

That's where the game-changing innovation of TaC Coating enters the picture, and why our advanced solutions at Semicorex are engineered to directly address your most persistent production pain points. Graphite is fantastic for its thermal properties, but without a robust shield, it simply cannot wit......

Etching and Etched Morphology

In the semiconductor chip manufacturing process, we are like building a skyscraper on a grain of rice. The lithography machine is like a city planner, using "light" to draw the blueprint for the building on the wafer; while etching is like a sculptor with precision tools, responsible for accurately ......

What are dishing and erosion in the CMP process?

Chemical mechanical polishing (CMP), which combines chemical corrosion and mechanical polishing to remove surface imperfections, is the significant semiconductor process for achieving overall planarization of the wafer surface. CMP results in two surface defects, dishing and erosion, which significa......

Why is CO2 introduced During the Wafer Saw Process

Introducing CO₂ to the dicing water is a significant technical measure in wafer saw process to suppress static electricity accumulation and reduce contamination, thereby improving the dicing yield and reliability of the chips.

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