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Quality comes first; service is foremost; business is cooperation" is our business philosophy which is constantly observed and pursued by our company for Deposition Semiconductor,Ceiling Plate,Silicon Wafer Chamber Lid,Sic Lid,Sintered Silicon Carbide Ceiling, Welcome your visiting and any your inquires,sincerely hope we can have chance to cooperate with you and we can build up long well business relationship with you.
Deposition Semiconductor, We set a strict quality control system. We have now return and exchange policy, and you can exchange within 7 days after receive the wigs if it is in new station and we service repairing free for our solutions. Please feel free to contact us for further information and we will offer you competitive price list then.

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  • CVD shower head with SiC Coat

    CVD shower head with SiC Coat

    Semicorex CVD shower head with SiC Coat represents an advanced component engineered for precision in industrial applications, notably within the realms of chemical vapor deposition (CVD) and plasma-enhanced chemical vapor deposition (PECVD). Serving as a critical conduit for the delivery of precursor gases or reactive species, this specialized CVD shower head with SiC Coat facilitates the precise deposition of materials onto a substrate’s surface, integral to these sophisticated manufacturing processes.
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    PSS Handling Carrier for Wafer Transfer

    Semicorex's PSS Handling Carrier for Wafer Transfer is engineered for the most demanding epitaxy equipment applications. Our ultra-pure graphite carrier can withstand harsh environments, high temperatures, and harsh chemical cleaning. The SiC coated carrier has excellent heat distribution properties, high thermal conductivity, and is cost-effective. Our products are widely used in many European and American markets, and we look forward to becoming your long-term partner in China.
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    Semicorex Al2O3 Cutting Blade,has been meticulously engineered to meet the rigorous demands of cutting processes across a spectrum of industries, including but not limited to film and foil, medical applications, and the intricate assembly of electronic components.**
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    In the front-end process (FEOL) of semiconductor manufacturing, the wafer needs to be subjected to various process treatments, especially the wafer needs to be heated to a certain temperature, and there are strict requirements, because the uniformity of temperature has a very important impact on the product yield; at the same time, semiconductor equipment needs to work in the presence of vacuum, plasma and chemical gases, which requires the use of ceramic heaters.

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  • Heteroepitaxy of 3C-SiC: An Overview

    The development of 3C-SiC, a significant polytype of silicon carbide, reflects the continuous advancement of semiconductor material science. In the 1980s, Nishino et al. first achieved a 4 μm thick 3C-SiC film on a silicon substrate using chemical vapor deposition (CVD)[1], laying the foundation for 3C-SiC thin-film technology.

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