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China UV LED Chip Epitaxy Manufacturers, Suppliers, Factory

All we do is usually affiliated with our tenet " Buyer to start with, Belief to start with, devoting about the food packaging and environmental defense for UV LED Chip Epitaxy,Silicon Carbide-Coated,SiC Graphite Supplies Susceptors,Graphite Susceptors for Silicon,SiC Coating for GaN Epitaxy, sincerity and strength ,constantly preserve approved superior quanlity ,welcome to our factoty for pay a visit to and instruction and organization.
UV LED Chip Epitaxy, Our main objectives are to provide our customers worldwide with good quality, competitive price, satisfied delivery and excellent services. Customer satisfaction is our main goal. We welcome you to visit our showroom and office. We're looking forward to establish business relation with you.

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  • SiC Powder

    SiC Powder

    Semicorex SiC Powder, also known as silicon carbide powder, is a finely ground material predominantly composed of N-type α-phase silicon carbide. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiN Plates

    SiN Plates

    Semicorex SiN Plates are versatile materials, prized for their mechanical strength, thermal conductivity, and electrical insulation, making them ideal for circuit substrates and heat spreaders. Choosing Semicorex SiN plates ensures high-quality, reliable performance for advanced electronic applications, backed by cutting-edge technology and stringent quality control.*
  • SiC Ceramic Seal Ring

    SiC Ceramic Seal Ring

    The SiC Ceramic Seal Ring is renowned for its robust performance and durability. Semicorex offers high-quality SiC Ceramic Seal Rings that meet the stringent demands of modern industry. These rings have become indispensable in enhancing the efficiency and reliability of mechanical seals.**
  • AlN Heaters

    AlN Heaters

    Semicorex AlN heaters are advanced ceramic-based heating elements designed for high-performance thermal applications. These heaters offer exceptional thermal conductivity, electrical insulation, and resistance to chemical and mechanical stress, making them ideal for demanding industrial and scientific applications. AlN heaters provide precise and uniform heating, ensuring efficient thermal management in environments requiring high reliability and durability.*
  • Quartz Melting Pot

    Quartz Melting Pot

    Semicorex quartz melting pot is a high-temperature resistant container made of high-purity quartz. It is mainly used in the semiconductor and photovoltaic industries to hold silicon melt liquid during the silicon single crystal pulling process. Semicorex has excellent technology, precise engineering design and customized services. Please choose Semicorex to be your reliable long term partner.
  • Monocrystalline silicon planar target

    Monocrystalline silicon planar target

    Monocrystalline silicon planar target from Semicorex is a crucial component in cutting-edge semiconductor manufacturing industry. Manufactured by top-quality monocrystalline silicon material, it features a highly ordered crystal structure and remarkable purity. These properties make it an ideal solution for manufacturing reliable, high-performance semiconductor films and optical films.
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    The process of isostatic graphite manufacturing is Selecting raw materials, Blending, Molding, Isostatic pressing, Carbonization, Graphitization. 

  • Silicon Carbide Wafer Epitaxy Technology

    Silicon Carbide generally uses the PVT method, with a temperature of more than 2000 degrees, a long processing cycle, and low output, so the cost of Silicon Carbide substrates is very high.

  • What is CMP Process

    In semiconductor manufacturing, atomic-level flatness is usually used to describe the global flatness of the wafer, with the unit of nanometers (nm).

  • Chip Manufacturing: Thin Film Processes

    The semiconductor thin film deposition process is an essential component of modern microelectronics technology. It involves constructing complex integrated circuits by depositing one or more thin layers of material on a semiconductor substrate.

  • Final polishing of the silicon wafer surface

    To achieve the high-quality requirements of IC chip circuit processes with line widths smaller than 0.13μm to 28nm for 300mm diameter silicon polishing wafers, it is essential to minimize contamination from impurities, such as metal ions, on the wafer's surface.

  • What are the technical difficulties of SiC crystal growth furnace

    The crystal growth furnace is the core equipment for the growth of Silicon Carbide crystals. It is similar to the traditional crystalline silicon-grade crystal growth furnace. The furnace structure is not very complicated. It is mainly composed of the furnace body, heating system, coil transmission mechanism, vacuum acquisition and measurement system, gas path system, cooling system, control system, etc. The thermal field and process conditions determine the key indicators such as the quality, size, and conductivity of the SiC crystal.

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