PFA Wafer Cassettes

PFA Wafer Cassettes are engineered with precision smooth surfaces that are nonporous too to minimize particle adherence and allow for cleaning. Wafer cassettes achieve high cleanliness levels at today's fabs where even sub-micron contamination can result in yield loss or device failure. The type of smooth internal contours reduce scratching of the delicate wafer surfaces, and allow for orderly drainage of liquids after wet processing to prevent a slurry of chemical residues from remaining on or touching the wafers whilst increasing process consistency and reduced need for cleaning efforts a second time.

An additional major advantage of PFA Wafer cassettes is the dimensional accuracy and structural stability. The cassette fabrication process requires tighter tolerances than is normally expected, which allows for the cassette to firmly hold wafers in such a way that there is no unwanted shifting or unwanted contact of the wafers during transfer. The cassettes are position or featureally consistent whether it be for manual handling or during automated wafer transport systems. PFA Wafer Cassettes will precisely conform to the standard physical breakouts associated with industry standard wafer handling and transport systems. The Long and useful service reliability associated with PFA Wafer Cassettes increases the value of investment as PFA can withstand being re-used after repeated chemical, thermally cycling and mechanical exposures.

PFA Wafer Cassettes are valuable assets not just in wet chemical processing to protect wafers but for storage and transport. They are built with inert materials to keep wafers clean during the cooling process, and their durability should limit breakage and edge chips from packaging and transport. PFA Wafer Cassettes are important to semiconductor fabs as well as research labs, photovoltaic manufacturing, and other industries needing high purity wafer handling.

PFA Wafer Cassettes also bring favorable sustainability and cost per use. The building materials are resilient to chemical attack and easy to clean so that they are reusable, lowering waste and disposables and encouraging repeated use to decrease long-term operational expense. Noting the common breakdown of a wafer when there is contamination, decreasing contamination events and wafer loss will increase yield and decrease defectivity. The loss of yield and increased canvas defectivity are major factors in ontology on the competitiveness of a semiconductor manufacturing operation.