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"Based on domestic market and expand abroad business" is our improvement strategy for graphite companies,high purity graphite,isostatic graphite,Graphite Crucible,specialty graphite, Now we have established steady and long business relationships with customers from North America, Western Europe, Africa, South America, more than 60 countries and regions.
graphite companies, Each product is carefully made, it will make you satisfied. Our products in the production process have got strictly monitored, because it is only to provide you the best quality, we will feel confident. High production costs but low prices for our long-term cooperation. You can have a variety choices and the value of all types are same reliable. If you have any question, do not hesitate to ask us.

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  • Zirconia Ceramic Nozzle

    Zirconia Ceramic Nozzle

    Semicorex Zirconia Ceramic Nozzle, crafted with meticulous attention to detail, this nozzle stands as the epitome of excellence in controlling the flow rate of both gases and liquids with unparalleled uniformity and precision. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiC Reflector

    SiC Reflector

    Semicorex SiC reflector is a pivotal element in various semiconductor manufacturing processes. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China*.
  • SiC Boat

    SiC Boat

    Semicorex SiC Boat is advanced component meticulously designed for semiconductor manufacturing, specifically in diffusion and thermal processes. With our unwavering commitment to providing high-quality products at competitive prices, we are prepared to be your long-term partner in China.*
  • CVD SiC Shower head

    CVD SiC Shower head

    Semicorex CVD SiC Shower Head is a core component used in semiconductor etching equipment, serving as both an electrode and a conduit for etching gases. Choose Semicorex for its superior material control, advanced processing technology, and reliable, long-lasting performance in demanding semiconductor applications.*
  • TaC Coated Planetary Plate

    TaC Coated Planetary Plate

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  • Related Blog
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  • What is SiC epitaxy?

    Silicon Carbide (SiC) epitaxy is a key technology in the field of semiconductors, particularly for the development of high-power electronic devices. SiC is a compound semiconductor with a wide bandgap, which makes it ideal for applications that require a high-temperature and high-voltage operation.

  • Begin Production of 3C-SiC Wafer

    The thermal conductivity of bulk 3C-SiC, recently measured, is the second-highest among inch-scale large crystals, ranking just below diamond. Silicon carbide (SiC) is a wide bandgap semiconductor extensively used in electronic applications, and it exists in various crystalline forms known as polytypes. Managing high localized heat flux is a significant challenge in power electronics, as it can lead to device overheating and long-term performance and reliability issues.

  • What is liquid phase epitaxy?

    The liquid phase method is closer to the thermodynamic equilibrium conditions and is able to grow SiC crystals with better quality.

  • What is C/C composite?

    C/C composite is a carbon-carbon composite material made of carbon fibers as reinforcement and carbon as matrix through processing and carbonization, with excellent mechanical and high-temperature resistance properties. The material was initially used in aerospace and special fields, and with the maturity of the technology, it has been gradually used in photovoltaic, automotive, lithium battery, medical devices and other fields.

  • Method for preparing SiC powder

    Silicon carbide (SiC) is an inorganic substance. The amount of naturally occurring silicon carbide is very small. It is a rare mineral and is called moissanite. Silicon carbide used in industrial production is mostly artificially synthesized.

  • Final polishing of the silicon wafer surface

    To achieve the high-quality requirements of IC chip circuit processes with line widths smaller than 0.13μm to 28nm for 300mm diameter silicon polishing wafers, it is essential to minimize contamination from impurities, such as metal ions, on the wafer's surface.

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