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  • MOCVD 3x2’’ Susceptor

    MOCVD 3x2’’ Susceptor

    Semicorex MOCVD 3x2’’ Susceptor developed by Semicorex represents a pinnacle of innovation and engineering excellence, specifically tailored to meet the intricate demands of contemporary semiconductor manufacturing processes.**
  • Diffusion Furnace Tube

    Diffusion Furnace Tube

    Semicorex Diffusion Furnace Tube is a crucial component within semiconductor manufacturing equipment, specifically designed to facilitate precise and controlled reactions essential for semiconductor fabrication processes. As the primary vessel within the reaction zone of a semiconductor furnace, the diffusion furnace tube plays a pivotal role in ensuring the integrity and quality of the produced semiconductor devices. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Baffle Wafer Boat

    Baffle Wafer Boat

    Semicorex Baffle Wafer Boat is a highly advanced piece of equipment used in semiconductor processing. It has been meticulously designed to ensure the delicate wafers are kept safe during the critical stages of production. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Teflon Cassette

    Teflon Cassette

    Semicorex Teflon Cassette is a high-performance carrier designed for the efficient handling and cleaning of wafers in semiconductor, photovoltaic, and electronics industries. Choose Semicorex for our reliable, durable, and cost-effective solutions that ensure optimal wafer quality and long-lasting performance throughout the manufacturing process.*
  • Silicon Nitride Plates

    Silicon Nitride Plates

    Semicorex Silicon nitride plates are high-strength ceramic substrates designed to deliver exceptional thermal performance and mechanical reliability for advanced power modules. Choosing Semicorex means benefiting from precision manufacturing, strict quality control, and materials engineering expertise that ensure consistent performance even in the most demanding applications.*
  • Semiconductor Quartz Crucibles

    Semiconductor Quartz Crucibles

    Semicorex Semiconductor Quartz Crucibles are high-purity fused quartz containers engineered for the demanding silicon single crystal pulling process in semiconductor manufacturing. Choosing Semicorex means benefiting from advanced multi-layer crucible technology, exceptional material purity, and stringent quality control that ensure superior crystal quality and consistent production performance.*
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  • Differences between SiC crystals with different structures

    Silicon carbide (SiC) is a material that possesses exceptional thermal, physical and chemical stability, exhibiting properties that go beyond those of conventional materials. Its thermal conductivity is an astonishing 84W/(m·K), which is not only higher than copper but also three times that of silicon. This demonstrates its enormous potential for use in thermal management applications.

  • Introducing Silicon Material

    Silicon is the second most abundant element on Earth after oxygen. Most silicon is found in soil, rocks, natural water, trees, and plants.

  • Annealing Processes in Modern Semiconductor Manufacturing

    As technology nodes continue to shrink, the formation of ultra-shallow junctions presents significant challenges. Thermal annealing processes including Rapid thermal annealing (RTA) and flash lamp annealing (FLA) are vital techniques that maintain high impurity activation rates while minimizing diffusion, ensuring optimal device performance.

  • 3 methods of graphite molding

    The four main molding methods for graphite molding are: extrusion molding, molding, vibratory molding and isostatic molding. Most of the common carbon/graphite materials on the market are molded by hot extrusion and molding (cold or hot), and isostatic molding is a method with leading molding performance. Vibration molding is generally used to manufacture medium and coarse structural graphite, particle size between 0.5-2mm particle size, generally dominated by di-roasted graphitized products, density between 1.55-1.75kg/m³, coarser particles, rougher surface, can not be used for precision machining. It is mainly used in chemical industry and metal smelting.

  • Coating in the thermal field of semiconductor silicon single crystals

    The coated parts in semiconductor silicon single crystal hot field are generally coated by CVD method, including pyrolytic carbon coating, Silicon Carbide coating and Tantalum Carbide coating, each with different characteristics.

  • What Is Silicon Carbide (SiC)?

    Semiconductor materials can be divided into three generations according to the time sequence. The first generation of germanium, silicon and other common monomaterials, which is characterised by convenient switching, generally used in integrated circuits. The second generation of gallium arsenide, indium phosphide and other compound semiconductors, mainly used for light-emitting and communication materials.

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