English
Home > Products > 300mm Silicon Wafer

China 300mm Silicon Wafer Manufacturers, Suppliers, Factory

Our rewards are lessen selling prices,dynamic sales team,specialized QC,solid factories,high quality services for 300mm Silicon Wafer,Crystal Growing,Graphite Plate,Epitaxial Wafer Manufacturers,SiC Epi Wafer, Any calls for from you'll be paid with our best interest!
300mm Silicon Wafer, High output volume, top quality, timely delivery and your satisfaction are guaranteed. We welcome all inquiries and comments. If you are interested in any of our items or have an OEM order to fulfill, make sure you feel free to contact us now. Working with us will save you money and time.

Related Products

Hot Products

  • SiC Ceramic Seal Part

    SiC Ceramic Seal Part

    Semicorex SiC Ceramic Seal Part stands as a testament to cutting-edge materials science and engineering prowess, designed to meet the exacting demands of high-performance mechanical sealing applications across a variety of industries.**
  • 4 Inch N-type SiC Substrate

    4 Inch N-type SiC Substrate

    Semicorex provides various types of 4H and 6H SiC wafers. We have been manufacturer and supplier of silicon carbide products for many years. Our 4 Inch N-type SiC Substrate has a good price advantage and cover most of the European and American markets. We look forward to becoming your long-term partner in China.
  • Carbon Carbon Composites

    Carbon Carbon Composites

    Semicorex Carbon Carbon Composites are advanced materials that offer exceptional lightweight strength, high thermal conductivity, and remarkable resistance to harsh conditions. Choose Semicorex for our unparalleled quality and innovative engineering, ensuring you receive reliable and high-performance solutions tailored to your specific needs.*
  • SiC Seal Parts

    SiC Seal Parts

    Semicorex SiC seal parts, or Silicon Carbide seal parts, represent a cutting-edge and highly efficient solution for various industrial applications where sealing integrity is paramount. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • SiC Arm

    SiC Arm

    Semicorex SiC Arm is a high-purity silicon carbide component designed for precise wafer handling and positioning in semiconductor manufacturing. Choosing Semicorex ensures unmatched material reliability, chemical resistance, and precision engineering that support the most demanding semiconductor processes.*
  • Wafer Boat Carrier

    Wafer Boat Carrier

    Semicorex Wafer Boat Carrier stands as a pinnacle of innovation in the realm of semiconductor processing. Crafted meticulously from graphite and fortified with a cutting-edge coating of Chemical Vapor Deposition (CVD) Silicon Carbide (SiC), this carrier exemplifies precision engineering and advanced materials science. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Related Blog
  • Reviews

  • What is the advantage of silicon carbide?

  • Semiconductor ceramic parts

    Semiconductor ceramic parts belong to advanced ceramics and are an indispensable part of the semiconductor manufacturing process. The raw materials for preparation are usually high-purity, ultra-fine inorganic materials, such as aluminum oxide, silicon carbide, aluminum nitride, silicon nitride, yttrium oxide, zirconium oxide, etc.

  • Synthesis method of high-purity Silicon Carbide (SiC) powder

    At present, the synthesis methods of high-purity SiC powder for growing single crystals mainly include: CVD method and improved self-propagating synthesis method (also known as high-temperature synthesis method or combustion method).

  • Defect Detection in Silicon Carbide Wafer Processing

    SiC substrates are the most crucial component in the silicon carbide industry, accounting for nearly 50% of its value. Without SiC substrates, it is impossible to manufacture SiC devices, making them the essential material foundation.

  • Ceramic Heaters

    In the front-end process (FEOL) of semiconductor manufacturing, the wafer needs to be subjected to various process treatments, especially the wafer needs to be heated to a certain temperature, and there are strict requirements, because the uniformity of temperature has a very important impact on the product yield; at the same time, semiconductor equipment needs to work in the presence of vacuum, plasma and chemical gases, which requires the use of ceramic heaters.

  • Dry Etching vs Wet Etching

    In semiconductor fabrication, etching is one of the major steps, along with photolithography and thin-film deposition. It involves removing unwanted materials from the surface of a wafer using chemical or physical methods. This step is carried out after coating, photolithography, and developing. It is used to remove the exposed thin film material, leaving only the desired portion of the wafer, and then removing the excess photoresist. These steps are repeated numerous times to create complex integrated circuits.

Send Inquiry

Hit enter to search or ESC to close
X
We use cookies to offer you a better browsing experience, analyze site traffic and personalize content. By using this site, you agree to our use of cookies. Privacy Policy
Reject Accept