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SiC wafer Grinding Plate

Advanced SiC wafer grinding plate from Semicorex is the precision machining part for achieving ultra-high flatness on semiconductor wafer surfaces. Selecting Semicorex SiC wafer grinding plate goes beyond selecting a high-performance tool, it secures the optimal, accurate, stable and efficient solution for wafer grinding applications.

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Wafer Edge Grinding Chuck

Semicorex Wafer Edge Grinding Chuck is a ceramic disk made from high-purity white alumina, designed for wafer edge grinding in semiconductor manufacturing. Choosing Semicorex ensures superior material quality, precision engineering, and reliable performance that support the most demanding wafer processing environments.*

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SiC Grinding Media

Semicorex SiC Grinding Media is crafted from silicon carbide ceramic, a material celebrated for its exceptional hardness and durability. Engineered to meet the rigorous demands of various industrial applications, SiC Grinding Media offers unparalleled efficiency and longevity.

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Silicon Carbide Wafer Grinding Wheel

Experience the epitome of precision in semiconductor wafer surface refinement with our cutting-edge Silicon Carbide Wafer Grinding Wheel. This disc-shaped component, meticulously designed for semiconductor equipment, redefines the standards of surface grinding, ensuring optimal results for semiconductor wafers. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.

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SiC Wafer Grinding Disk

Unlock unparalleled precision in semiconductor wafer surface finishing with our state-of-the-art SiC Wafer Grinding Disk. This essential component is meticulously designed for use in semiconductor equipment, specifically crafted to achieve optimal results in wafer grinding applications. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.

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