Semicorex poly-Si outer rings for etching are the precision-processed ring parts made of poly-silicon materials. Specifically engineered for the electrode systems of advanced etching equipment, Semicorex poly-Si outer rings for etching can effectively ensure the stability of the etching process. Choosing Semicorex means you will obtain the high-quality poly-Si outer rings for etching that can enhance wafer yield and operational efficiency.
Typically positioned around the showerhead, Poly-Si outer ring acts as the connecting part between the exhaust ring and the showerhead. It works cooperatively with the electrostatic chuck, the Si showerhead, the Si focus ring, the Si exhaust ring, and Si shielding ring, creating a steady and reliable process environment for high-precision etching operation.
Semicorex poly-Si outer rings for etching are precisely manufactured from high-quality polysilicon, delivering the following excellent property performance.
1.High cleanliness and low particle content
2.Superior high-temperature resistance and high thermal shock resistance
3.Dependable corrosion resistance
4.Exceptional electrical performance and high electrical conductivity uniformity
Used for electrode grounding and protection, Semicorex poly-Si outer rings for etching are able to avoid static accumulation as well as arc damage and ensure stable operation of the electrode system, perfectly meeting the process demands for advanced 3D NAND fabrication.
Semicorex poly-Si outer rings for etching serve as the essential components connecting the exhaust ring and showerhead. They provide reliable mechanical support to both parts and keep them steadily positioned in the suitable place. In addition, the use of Semicorex poly-Si outer rings for etching can prevent plasma erosion on the etching chamber, which thus effectively ensures the stable execution of the etching operation.
Semicorex poly-Si outer rings for etching feature low impurity content and exceptional corrosion resistance, delivering excellent compatibility with the fabrication of silicon wafers, which greatly lowers wafer defects caused by etched by-product contamination and significantly ensures a high yield rate in semiconductor production.