Vertical Quartz Wafer Boats

In semiconductor manufacturing processes, semiconductor components in the reaction chamber must meet strict high-cleanliness standards. Otherwise, even micro-scale or nano-scale impurities or contaminants can cause irreversible damage to the performance and yield of semiconductor devices.

Quartz wafer boats are commonly installed vertically in high-temperature reaction chambers like diffusion furnaces, oxidation furnaces, and annealing furnaces, where they need to be in direct contact with the wafers. Semicorex’s vertical quartz wafer boats are manufactured by high-purity quartz materials to satisfy these high-cleanliness requirements. This wise material selection effectively avoid wafer contamination caused by reactants released from the wafer boats during the manufacturing process.

In semiconductor manufacturing, wafer boats are required to not only undergo repeated heating-cooling cycles but also withstand the corrosion of process gases over prolonged time. Semicorex’s vertical quartz wafer boats exhibit exceptional dimensional stability in the challenging operating conditions of constant thermal cycling because of their inherent thermal stability. This superior thermal properties significantly prevent wafer deformation and damage caused by precision degradation or structural deformation of the vertical quartz wafer boats. What’s more, thanks to their high chemical inertness, vertical quartz wafer boats can be resistant to the reaction with corrosive gases like oxygen, water vapor, hydrogen chloride, and ammonia. This property greatly reduces the possibility that chemical corrosion will compromise the structural integrity of the vertical quartz wafer boats.

In addition to the performance advantages mentioned above, Semicorex’s vertical quartz wafer boats also demonstrate excellent competitiveness in dimensional accuracy and structural design. Each parts of them are manufactured by precision machining techniques. This pinpoint dimensional control ensures accurate wafer positioning, minimizing scratches and cracks caused by displacement or collisions during loading, processing, and unloading.