Semicorex quartz wafer cleaning tanks, precisely made of high-purity quartz materials, are the indispensable components specifically engineered for wafer wet cleaning in high-end semiconductor manufacturing. As the industry-leading company in China, Semicorex strives to provide customers with stable-performing and cost-effective quartz solutions.
In the advanced manufacturing fields like semiconductor integrated circuits, any minor contaminants including particle matter, metallic impurities and organic residues, will degrade device performance or even cause device failure. Wet cleaning is thus an essential process in production to ensure the cleanliness of the device. Quartz wafer cleaning tanks, the indispensable containers in this process, providing a suitable reaction environment for oxide layer stripping, organic contaminant decomposition and metallic ion extraction of wafers.
The quartz materials used for Semicorex quartz wafer cleaning tanks have ultra-high purity, and their key metallic impurities including Na, K, Fe and Cu, are controlled below ppb levels. This remarkable property can minimize the risk of metallic contamination originating from quartz wafer cleaning tanks during wafer cleaning processes, thus ensuring the wafer cleanliness and production yield.
Wet cleaning processes need to use corrosive solutions such as H₂SO₄, HNO₃, and aqua regia. These solutions exhibit strong corrosiveness toward most materials, especially under high-temperature operating conditions. Semicorex quartz wafer cleaning tanks boast reliable anti-corrosion performance, can consistently contain these corrosive solutions while maintaining stable structural integrity.
In order to speed up chemical reactions and enhance the cleaning effect, many wet cleaning procedures, such as RCA standard cleaning, require high temperatures. Semicorex quartz wafer cleaning tanks can effectively provide a constant thermal condition for temperature-dependent chemical reactions because of their stable thermal stability, which allows them to be free from creaking caused by sudden temperature changes.
Applied in wafer cleaning processes to ensure the precision and yield of the crucial processes such as photolithography and thin-film deposition.
Used for cleaning solar silicon wafers, including texturing, phosphosilicate glass (PSG) removal and damaged layer stripping and improves the conversion efficiency of solar cells.
Deliver a contamination-free environment for the wet cleaning processing of micro-precision structures when fabricating MEMS devices, compound semiconductors and optical fiber components.