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    High-Temperature SiC Coating for Plasma Etch Chambers

    When it comes to wafer handling processes such as epitaxy and MOCVD, Semicorex's High-Temperature SiC Coating for Plasma Etch Chambers is the top choice. Our carriers provide superior heat resistance, even thermal uniformity, and durable chemical resistance thanks to our fine SiC crystal coating.
  • Zirconia ZrO2 Robot Arm

    Zirconia ZrO2 Robot Arm

    Semicorex Zirconia ZrO2 Robot Arm, a vital component in semiconductor processing for seamless wafer transfer and handling. Crafted to endure the rigorous demands of high-temperature, corrosive, and abrasive environments, this ceramic arm boasts unparalleled durability and reliability. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.
  • Rigid Composite Felt

    Rigid Composite Felt

    Semicorex Rigid Composite Felt is a premium material crafted from a blend of PAN-based and viscose-based carbon fiber felts. Choose Semicorex for high-performance, durable Rigid Composite Felt that offer superior chemical resistance and thermal stability.*
  • Silicon on Insulator Wafers

    Silicon on Insulator Wafers

    Semicorex Silicon on Insulator Wafers are advanced semiconductor materials that enable superior performance, reduced power consumption, and enhanced device scalability. Choosing Semicorex's SOI wafers ensures you receive top-tier, precision-engineered products, backed by our expertise and commitment to innovation, reliability, and quality.*
  • CFC U-Channel

    CFC U-Channel

    Semicorex CFC U-Channel offers increased strength and excellent thermal performance in high-temperature environments, enabling processing efficiency and reliability.
  • Insulation Felt

    Insulation Felt

    Semicorex Insulation Felt for long crystal growth barrels is an essential component for manufacturers seeking to improve crystal yield, quality, and operational efficiency. Combining advanced material science with practical performance, it stands as a reliable solution for high-demand thermal management applications.*
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  • Taiwan's PSMC to Build 300mm Wafer Fab in Japan

    Taiwan's Power Semiconductor Manufacturing Corporation (PSMC) has announced plans to build a 300mm wafer fab in Japan in collaboration with SBI Holdings. The purpose of this collaboration is to strengthen Japan's domestic IC (integrated circuit) supply chain, with a particular focus on circuits for AI edge computing and packaging technologies.

  • What is cantilever paddles?

    The wafer boats, loaded with a batch of wafers to be processed, are positioned on long cantilevered paddles.

  • What is porous graphite?

    Porous graphite, also known as porous carbon or porous graphite material, is a graphite form that has been specially engineered to have an interconnected network of pores or voids within its structure.

  • Released 850V High Power GaN HEMT Epitaxial Products

    In November 2023, Semicorex released 850V GaN-on-Si epitaxial products for high-voltage, high-current HEMT power device applications. Compared to other substrates for HMET power devices, GaN-on-Si enables larger wafer sizes and more diversified applications, and it can also be quickly introduced into the mainstream silicon chip process in fabs, which is a unique advantage for improving the yield of power devices.

  • Why Doesn’t Gllium Nitride (GaN) Epitaxy Grow on a GaN substrate?

    The growth of GaN epitaxy on GaN substrate presents a unique challenge, despite the material’s superior properties when compared to silicon. GaN epitaxy offers significant advantages in terms of band gap width, thermal conductivity, and breakdown electric field over silicon-based materials. This makes the adoption of GaN as the backbone for the third generation of semiconductors, which provide enhanced cooling, lower conduction loss, and improved performance under high temperatures and frequencies, a promising and crucial advancement for the photonic and micro-electronic industries.

  • Exploring the Future Prospects of Silicon Semiconductor Chips

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