Alumina Wafer Polishing Plates

Semicorex alumina wafer polishing plates are precision machined parts made from high-purity alumina by isostatic pressing, high-temperature sintering and precision machining. They are ideal for precision polishing applications with stringent requirements for ultra-high surface precision and efficiency, particularly for semiconductor wafer polishing, because alumina ceramic offers exceptional physical and chemical properties.

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Long lifespan for Excellent wear resistance

High wear resistance is essential for wafer polishing plates used in high-precision machining. The Mohs hardness of alumina ceramic is around 9, second only to the diamond and silicon carbide, which allows wafer polishing plates to withstand the high-speed, high-duty friction operating conditions during semiconductor wafer polishing with low wear loss. With this excellent wear resistance, alumina wafer polishing plates exhibit durable service life, significantly lowering the frequency of equipment shutdowns for replacement and cutting down maintenance and replacement expenses.

Exceptional thermal stability and high temperature resistance

Alumina wafer polishing plates can maintain their physical properties and friction performance during 1000℃ high-temperature environments due to their exceptional thermal stability and high temperature resistance. They are suitable for the high temperature working conditions caused by frequent friction, effectively avoiding thermal deformation and contributing to keep a constant polishing surface.

Reliable chemical corrosion resistance

Alumina wafer polishing plates feature reliable chemical corrosion resistance. They can withstand the most acids and alkalis, as well as common chemical polishing solutions used in CMP process. Their surface flatness will not be compromised by chemical corrosion, thus affecting the surface quality of semiconductor wafers.

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Applications for Semicorex Alumina wafer polishing plates

1.Semiconductor wafer polishing

Alumina wafer polishing plates are widely used in the grinding, rough polishing and finish polishing of silicon, SiC, sapphire and various wafer substrates. Thanks to their ultra-low roughness and nanoscale surface flatness, alumina wafer polishing plates can ideally meet the exacting surface quality requirements of advanced semiconductor processes like etching and lithography.

2.Wafer thinning and edge polishing

During the wafer thinning process, alumina wafer polishing plates can be used to precisely control wafer thickness and uniformly remove backside materials. In the edge polishing process, alumina polishing plates can also help achieve the optimal wafer edge quality by eliminating burrs and defects at the wafer edges.