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Semiconductor Quartz Bell Jar

Semiconductor Quartz Bell Jar

Semicorex Semiconductor Quartz Bell Jar is a specialized vessel constructed from high-purity quartz material. Its design is tailored to meet the stringent requirements of semiconductor manufacturing processes, where purity and cleanliness are paramount. Semicorex is committed to providing quality products at competitive prices, we look forward to becoming your long-term partner in China.

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Product Description

Semicorex Semiconductor Quartz Bell Jar is typically fabricated from synthetic fused quartz, a material known for its exceptional purity, high-temperature resistance, and low thermal expansion properties. This ensures that the chamber does not introduce contaminants or impurities into the semiconductor fabrication process.

Semiconductor Quartz Bell Jar is typically cylindrical or dome-shaped, with a flat or slightly curved base to accommodate semiconductor wafers or substrates. It features a precision-engineered, airtight sealing mechanism, such as a flange or O-ring seal, to maintain a vacuum or controlled atmosphere inside the chamber during processing.

Semiconductor Quartz Bell Jar offers excellent optical clarity, allowing operators to visually monitor processes inside the chamber without compromising accuracy or introducing interference. Quartz is highly resistant to chemical attack from most acids, bases, and solvents commonly used in semiconductor fabrication processes. This ensures the integrity of the chamber and prevents contamination of the substrates.

Quartz has a high melting point and thermal stability, allowing the Semiconductor Quartz Bell Jar to withstand elevated temperatures encountered during deposition or annealing processes without deformation or degradation.


Applications:

Deposition: Semiconductor Quartz Bell Jars are used in various deposition techniques such as chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) to deposit thin films of materials onto semiconductor substrates with precision and uniformity.

Etching: They are employed in plasma etching processes to selectively remove material from semiconductor wafers, creating intricate patterns and structures with high accuracy and repeatability.

Annealing: Bell jars are utilized in annealing processes to subject semiconductor wafers to controlled thermal treatment, facilitating crystallization, dopant activation, and stress relief in deposited films.



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