Major ceramic components in semiconductor manufacturing

Semiconductor equipment consists of chambers and chambers, and most ceramics are used in chambers closer to the wafers. Ceramic parts, important components widely used in the cavities of core equipment, are semiconductor equipment components manufactured through precision processing using advanced ceramic materials such as alumina ceramics, aluminum nitride ceramics, and silicon carbide ceramics. Advanced ceramic materials have excellent performance in strength, precision, electrical properties, and corrosion resistance, and can meet the complex performance requirements of semiconductor manufacturing in special environments such as vacuum and high temperature. Advanced ceramic material components of semiconductor equipment are mainly used in chambers, and some of them are in direct contact with the wafer. They are key precision components in integrated circuit manufacturing and can be divided into five categories: annular cylinders, airflow guides, load-bearing and fixed types, gripper gaskets, and modules. This article mainly talks about the first category: annular cylinders.

Rings and Cylinders

1. Moiré Rings: Mainly used in thin film deposition equipment. Located within the process chamber, they come into direct contact with the wafer, enhancing gas guidance, insulation, and corrosion resistance.

2. Guard Rings: Mainly used in thin film deposition equipment and etcher. Located within the process chamber, they protect key module components such as the electrostatic chuck and ceramic heater.

3. Edge Rings: Mainly used in thin film deposition equipment and etcher. Located within the process chamber, they stabilize and prevent plasma from escaping.

4. Focusing Rings: Mainly used in thin film deposition equipment, etcher, and ion implantation equipment. Located within the process chamber, they are less than 20mm from the wafer, focusing the plasma within the chamber.

5. Protective Covers: Mainly used in thin film deposition equipment and etcher. Located within the process chamber, they seal and absorb process residues.

6. Grounding Rings: Mainly used in thin film deposition equipment and etcher. Located outside the chamber, they secure and support components.

7. Liner: Primarily used in etchers, located within the process chamber, it enhances gas guidance and ensures more uniform film formation.

8. Insulation Cylinder: Primarily used in thin film deposition equipment, etchers, and ion implanters, it is located within the process chamber and improves the equipment's temperature control performance.

9. Thermocouple Protection Tube: Primarily used in various semiconductor front-end equipment, it is located outside the chamber and protects thermocouples in a relatively stable temperature and chemical environment.

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