In the semiconductor manufacturing field, the steps from silicon crystal growth to oxidation diffusion, from etching to cleaning, the quartz structural components are involved in the whole process. With the development of advanced processes, the tolerance for contamination by metal impurities and particles is becoming increasingly lower at each step.
The synthesis quartz has the figures such as high purity, non bubble, no inclusion particles, high UV transmittance, etc. It makes it gradually replace the traditional natural quartz materials in advanced manufacturing processes, which can significantly improve the yield and extend the lifespan.
Under the bombardment of plasma (containing highly reactive fluorine and chlorine-based gases), materials require extremely high chemical inertness and corrosion resistance. Simultaneously, quartz materials need to possess extremely high purity to prevent particle contamination from etching. Etching rings are consumable components; currently, most equipment uses natural quartz. However, some advanced processes (2nm, 5nm, and other processes below 28nm) have replaced them with synthetic quartz etching rings due to strict control over particles and metal ions.
A transparent dome-shaped observation window installed at the top of the reaction chamber in etching and thin-film deposition (such as CVD) equipment. It not only needs extremely high purity to prevent impurities from contaminating the process chamber but also requires certain optical properties to allow light signals from the detection system to pass through for real-time monitoring of the process. Synthetic quartz, with its extremely high transmittance and high purity, is widely used in DOME (Diffusion Oxidation).
In high-temperature oxidation/diffusion furnaces, it serves as the core tubular container holding the wafer and carrying out the process reaction. Extremely high heat resistance is required, enabling long-term operation at temperatures above 1200°C without softening or deformation. Natural quartz, due to its high Al content and low hydroxyl content, achieves high heat resistance and is widely used in furnace tubes. However, as advanced processes impose increasingly stringent controls on metal impurity ions in the chamber, highly heat-resistant synthetic quartz materials are gradually replacing natural quartz furnace tubes.
Used to hold high-purity, highly corrosive cleaning solutions (such as SC1, SC2, hydrofluoric acid, sulfuric acid, etc.) for wet cleaning of wafers. Quartz materials have excellent resistance to acid and alkali corrosion: they can resist the erosion of almost all strong acids (except hydrofluoric acid and hot phosphoric acid), ensuring the tank remains uncorroded for long-term use. However, with prolonged use, metal ions in the quartz tank are gradually released, easily causing contamination. PPB-grade synthetic quartz effectively reduces metal impurity ion contamination, and its bubble-free nature makes it more suitable for processing smooth, dense surfaces, reducing contaminant adhesion.
Installed on UV curing equipment, it serves as a window for transmitting UV light. Among all optical materials, synthetic quartz has the highest transmittance in the deep ultraviolet (DUV) to ultraviolet (UV) bands (down to 185nm). Its high strength and radiation resistance also ensure that its performance does not degrade or discolor under prolonged UV irradiation.
In advanced packaging processes (such as Fan-Out, 2.5D/3D IC), synthetic quartz carrier wafers can be used as carrier plates for temporarily supporting, fixing, transporting, and processing ultra-thin wafers or reconstructing wafers. Synthetic quartz material can be processed to achieve excellent flatness and rigidity, providing solid support for ultra-thin chips and ensuring process accuracy.
Semicorex supplies high-quality customized quartz components for different processing. For customized solutions or additional technical information, please feel free to contact our engineering team.
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Email: sales@semicorex.com